Aluminum oxide composite material and preparation method thereof, and copper clad base plate

A composite material and alumina technology, which is applied in the field of composite material preparation, can solve problems such as clusters and limit the application of alumina composite materials

Active Publication Date: 2014-04-16
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the size and shape mismatch between graphene oxide and alumina during the modification process, the graphene oxide-modified alumina composite is prone to clustering, which limits the application of this alumina composite.

Method used

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  • Aluminum oxide composite material and preparation method thereof, and copper clad base plate
  • Aluminum oxide composite material and preparation method thereof, and copper clad base plate
  • Aluminum oxide composite material and preparation method thereof, and copper clad base plate

Examples

Experimental program
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Effect test

preparation example Construction

[0052] Such as figure 1 The preparation method of the alumina composite material shown in one embodiment includes the following steps:

[0053] S10, providing alumina particles coated with graphene oxide.

[0054] The alumina particles coated with graphene oxide can be prepared by the following method:

[0055] Add alumina particles with a particle size of 200nm to 3μm into the solvent, ultrasonically disperse them and add them to an oil bath, heat up to 90°C, add surface modifier, then stir and heat up to 115°C for 4 hours, cool and filter and retaining the filter residue; washing the filter residue and drying it, then adding the dried filter residue into the graphene oxide aqueous solution under stirring, stirring for 3 hours, and centrifuging to obtain graphene oxide-coated alumina particles.

[0056] The particle size of the aluminum oxide particles is 200 nm to 3 μm.

[0057] The mass ratio of graphene oxide to alumina particles is 1-2:100.

[0058] The solvent can be...

Embodiment 1

[0083] (1) Preparation of graphene oxide-coated alumina particles.

[0084] Add 30mL of xylene and 10.0g of alumina with a particle size of 200nm into a three-neck flask, ultrasonically disperse for 10min, put it into an oil bath, stir the solution magnetically and raise the temperature to 90°C. Add 0.80 g of the surface modifier γ-aminopropyltriethoxysilane dropwise with a dropper, raise the temperature to 115° C. after the dropwise addition, keep magnetic stirring, and react for 4 hours.

[0085] Cool the mixed solution, pour it into a suction filter funnel while it is hot, wash the sample obtained by suction filtration twice with ethanol, and put it in a vacuum drying oven for 6 hours at 150°C to obtain γ-aminopropyltriethoxysilane-alumina.

[0086] Add 50 mL of graphene oxide aqueous solution and 10 mL of ultrapure water into a three-necked flask, stir and mix evenly, and then add 10.0 g of γ-aminopropyltriethoxysilane-alumina. The solution was magnetically stirred at roo...

Embodiment 2

[0099] The preparation method is the same as that of Example 1, the only difference being that the particle size of alumina used in step (1) is 3 μm; adding 0.20 g of surface modifier γ-aminopropyltriethoxysilane; Stir for 2h.

[0100]The prepared copper-clad substrate includes a first electrode layer, a dielectric layer and a second electrode layer stacked in sequence, wherein the first electrode layer and the second electrode layer are copper foil sheets with a thickness of 35 microns, and the dielectric layer consists of two prepregs composition, with a thickness of 70 microns. The thermal conductivity of the substrate material is 1.5W / m·K, the dielectric loss is 0.025 (1.0MHz), and the dielectric constant is 3.9 (1.0MHz).

[0101] image 3 The SEM photo of the alumina particles coated with graphene oxide prepared in this embodiment is obtained by image 3 It can be seen that graphene oxide is coated on the surface of alumina particles, and graphene oxide acts as a bridg...

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Abstract

The invention discloses an aluminum oxide composite material which graphene-oxide-coated aluminum oxide particles, an allyl phenolic compound modified bismaleimide-cyanate composite and a curing agent. The aluminum oxide surface is coated with the graphene oxide laminae and the allyl phenolic compound modified bismaleimide-cyanate composite, and the graphene oxide and the allyl phenolic compound modified bismaleimide-cyanate composite have high interaction force, thereby enhancing the interfacial interaction, lowering the interface resistance and reducing the cluster phenomenon. Compared with the traditional aluminum oxide composite material, the aluminum oxide composite material disclosed by the invention can not easily produce the cluster phenomenon. The invention also discloses a preparation method of the aluminum oxide composite material and a copper clad base plate using the aluminum oxide composite material.

Description

technical field [0001] The invention relates to the field of preparation of composite materials, in particular to an alumina composite material, a preparation method thereof, and a copper-clad substrate using the alumina composite material. Background technique [0002] Copper-clad substrate is a plate material made by impregnating electronic glass fiber cloth or other reinforcing materials with resin, covering one or both sides with copper foil and hot pressing. The copper-clad substrate mainly provides three functions of conductivity, insulation and support for the chip, and is a key raw material for manufacturing PCBs. In recent years, electronic products are developing in the direction of portability, miniaturization, light weight and multi-function. This market demand puts forward higher requirements for copper clad substrates. [0003] Alumina is by far the most commonly used substrate material in the microelectronics industry because it outperforms most other oxide c...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08K9/10C08K9/06C08K3/22C08G73/10B32B15/08B32B27/04
CPCB32B15/08B32B27/04B32B2250/03C08G73/12C08K3/22C08K9/10C08K2003/2227C08K2201/003C08L79/085
Inventor 孙蓉曾小亮幺依民郭慧子彭崇南
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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