A kind of visible light curing adhesive and preparation method thereof
A visible light curing adhesive technology, applied in adhesives, adhesive additives, non-macromolecular organic compound adhesives, etc., can solve the problems of unavailable ingredients, environmentally friendly adhesives, and failure to meet performance requirements, achieving shortened curing time, The effect of tight distribution and improved bond strength
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Embodiment 1
[0041] (1) Heat 20.0g of bisphenol A diglycidyl methacrylate (Bis-GMA) and 10.0g of diethylene glycol dimethacrylate to 40-50°C and mix evenly to form a matrix;
[0042] (2) Take 3.0g of the matrix and add 0.95g of 7-amino-4-methylcoumarin and 0.95g of N,N-dimethylaminoethyl methacrylate (DMAEMA), mix and disperse evenly at 40-50°C , forming a premix;
[0043] (3) Add the premix to the rest of the matrix, add 68.0g of silica with a particle size of 0.7μm and 0.1g of fumed silica with a particle size of 5nm, and mix well at 40-50°C , and then vacuumized, degassed and sealed to obtain visible light-curable adhesive A.
Embodiment 2
[0045] (1) Mix 30.0g of ethoxylated bisphenol A dimethacrylate (Bis-EMA) and 20.0g of triethylene glycol dimethacrylate at 50-60°C to form a matrix;
[0046] (2) Take 2.5g of the matrix and add 0.7g of 7-amino-4-trifluoromethylcoumarin, 0.15g of N,N-dimethylaminoethyl methacrylate (DMAEMA) and 0.15g of N,N-dimethyl Neopentyl glycol aminomethacrylate, mix and disperse evenly at 50-60°C to form a premix;
[0047] (3) Add the premix to the rest of the matrix, add 46g of silicon dioxide with a particle size of 1.5μm and 3.0g of fumed silica with a particle size of 10nm, and mix uniformly at 50-60°C, Then vacuumize, degas and seal to obtain visible light-curable adhesive B.
Embodiment 3
[0049] (1) 20.0g ethoxylated bisphenol A dimethacrylate (Bis-EMA), 20.0g pentaerythritol tetraacrylate, 15.0g diethylene glycol dimethacrylate and 10.0g polypropylene glycol dimethacrylate Mix evenly at 40-50°C to form a matrix;
[0050] (2) Take 13.0g of the matrix and add 1.4g camphorquinone and 0.7g N,N-dimethylaminobenzoyl ethyl methacrylate (DMABEMA), mix and disperse evenly at 40-50°C to form a premix ;
[0051] (3) Add the premix to the rest of the matrix, add 30.9g of silicon dioxide with a particle size of 4μm and 2.0g of fumed silica with a particle size of 20nm, and mix uniformly at 40-50°C, Then vacuumize, degas and seal to obtain visible light-curable adhesive C.
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