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Flexible embedded type optical interconnection structure and manufacturing method of flexible embedded type optical interconnection structure

An embedded and optical interconnection technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve the problems of immature mass production of organic optical waveguide materials, and achieve the effect of simple manufacturing process

Active Publication Date: 2014-05-07
NAT CENT FOR ADVANCED PACKAGING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Whether it is a rigid optical PCB board or a flexible optical PCB board, it needs to be applied to the organic optical waveguide. At present, because the organic optical waveguide material is far from mature and mass-produced, it has virtually become an important factor restricting the popularization of optical PCB boards.

Method used

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  • Flexible embedded type optical interconnection structure and manufacturing method of flexible embedded type optical interconnection structure
  • Flexible embedded type optical interconnection structure and manufacturing method of flexible embedded type optical interconnection structure
  • Flexible embedded type optical interconnection structure and manufacturing method of flexible embedded type optical interconnection structure

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Embodiment 1

[0033] A flexible embedded optical interconnection structure, comprising an optical waveguide plate 1 composed of a cladding material 3 and an optical waveguide 2 embedded in the cladding material 3, the optical waveguide plate 1 is provided with a light reflection The laser ablation groove 4 of the interface 5, the side of the laser ablation groove 4 on the optical waveguide plate 1 is vertically provided with a through hole 6 penetrating the optical waveguide plate 1; the upper and lower surfaces of the optical waveguide plate 1 are sequentially provided with Patterned electroless copper plating layer 7, metal electroplating layer 8 and metal protective layer 9, photoelectric chip 10 and electric chip 11 are installed above the metal protective layer 9 on the upper surface of the optical waveguide plate 1, and the photoelectric chip 10 and electric chip 11 are covered There is a sealing colloid 13 ; an external electrical interface is provided under the metal protection layer...

Embodiment 2

[0065] In this embodiment, the external electrical interface is a golden finger, and the structure of one end of this embodiment is as follows Figure 5 shown. Gold fingers 18 are located on the top of the flexible embedded optical interconnection structure, and can be distributed on one side (upper surface or lower surface) of the optical waveguide plate 1 , or can be distributed on the upper and lower surfaces of the optical waveguide plate 1 at the same time. The optical interconnection structure is electrically pluggable, flexible to use, and convenient to replace.

[0066] The structure of this embodiment applied to the printed circuit board is as follows: Image 6 shown. The golden finger is arranged on the printed circuit board through the connector 19, which is a board edge connector suitable for flexible materials and has sufficient high-frequency bandwidth. The connector 19 is welded on the printed circuit board 16 through the pad 17 , and the gold finger 18 of th...

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PUM

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Abstract

The invention discloses a flexible embedded type optical interconnection structure and a manufacturing method of the flexible embedded type optical interconnection structure. The flexible embedded type optical interconnection structure comprises an optical waveguide board, laser ablation grooves are formed in the optical waveguide board, and through holes are formed in the two sides of the laser ablation grooves of the optical waveguide board. The upper surface and the lower surface of the optical waveguide board are sequentially provided with electroless copper plating layers with patterns, metal electroplating layers and metal protecting layers from inside to outside, a photoelectric chip and an electric chip are installed above the metal protecting layer on the upper surface of the optical waveguide board, the photoelectric chip and the electric chip are covered with sealing rubber matrixes, and a welding ball is arranged below the metal protecting layer on the lower surface of the optical waveguide board. The flexible embedded type optical interconnection structure is simple in manufacturing process and suitable for mass production, and lays a foundation to popularization of optical PCBs.

Description

technical field [0001] The invention relates to the technical field of integrated electronics, in particular to an optical interconnection structure and a manufacturing method thereof. Background technique [0002] With the development of information technology and the application and popularization of optical communication technology, the performance of electronic systems is increasingly limited by the communication capacity of short distances (such as between frames, between cabinets, between boards and chips in boards). Active optical cables of different specifications and standards have been used to solve the communication bottleneck between frames and cabinets, and optical PCB boards can solve the problem of high-speed interconnection between boards and inside boards. [0003] Optical PCB boards are usually divided into two categories, rigid optical PCB boards and flexible optical PCB boards. Among them, there are also a lot of reports on the research results of rigid ...

Claims

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Application Information

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IPC IPC(8): H01L23/528H01L21/768
CPCH01L2224/16225
Inventor 李宝霞刘丰满薛海韵
Owner NAT CENT FOR ADVANCED PACKAGING