Ultraviolet-thermal dual-cured resin, anti-welding ink containing resin, and application of resin

A dual-curing, solder mask ink technology, used in inks, applications, household appliances, etc., can solve the problems of slow progress of TGIC substitutes, and achieve the effect of superior physical and chemical comprehensive properties, high solid content, and excellent pre-baking operation latitude.

Active Publication Date: 2014-05-14
JIANGSU KUANGSHUN PHOTOSENSITIVITY NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0022] The above-mentioned product market is becoming mature, but in terms of substitutability, its weather resistance, reactivity and pinhole resistance performance need to be further improved and improved, and the TGIC substitute market in China has been making slow progress. In view of this, the development It is of great significance to use a TGIC substitute with superior performance in various aspects as a curing agent for PCB solder mask ink

Method used

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  • Ultraviolet-thermal dual-cured resin, anti-welding ink containing resin, and application of resin
  • Ultraviolet-thermal dual-cured resin, anti-welding ink containing resin, and application of resin
  • Ultraviolet-thermal dual-cured resin, anti-welding ink containing resin, and application of resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] Novolac epoxy resin (manufactured by Changchun Chemical Industry, PNE-177, epoxy equivalent 177) 1320g, diethylene glycol ethyl ether acetate 220g, (meth)acrylic acid 161g, triphenylphosphine 1.8g, p-hydroxyanisole 0.6 g, added to a four-neck flask equipped with a stirrer, heated to 85-130°C and reacted for 8 hours until the acid value was less than 0.5 mgKOH / g. Lower the temperature to 80°C, add 53g of tetrahydrophthalic anhydride, and react at 90-120°C for 5 hours until the acid value is less than 0.2mgKOH / g, and the UV-photothermal dual-curing resin A is obtained.

Embodiment 2

[0052] Novolac epoxy resin (manufactured by Changchun Chemical Industry, PNE-177, epoxy equivalent 177) 1320g, diethylene glycol ethyl ether acetate 220g, (meth)acrylic acid 306g, triphenylphosphine 1.8g, p-hydroxyanisole 0.6 g, added to a four-neck flask equipped with a stirrer, heated to 85-130°C and reacted for 8 hours until the acid value was less than 0.5 mgKOH / g. Lower the temperature to 80°C, add 100g of tetrahydrophthalic anhydride, and react at 90-120°C for 5 hours until the acid value is less than 0.2mgKOH / g, and the UV-photothermal dual-curing resin B is obtained.

Embodiment 3

[0054] Novolac epoxy resin (manufactured by Changchun Chemical Industry, PNE-177, epoxy equivalent 177) 1320g, diethylene glycol ethyl ether acetate 220g, (meth)acrylic acid 376g, triphenylphosphine 1.8g, p-hydroxyanisole 0.6 g, added to a four-neck flask equipped with a stirrer, heated to 85-130°C and reacted for 8 hours until the acid value was less than 0.5 mgKOH / g. Cool down to 80°C, add 129g of tetrahydrophthalic anhydride, and react at 90-120°C for 5 hours until the acid value is less than 0.2mgKOH / g, and UV-light-thermal dual-curing resin C is obtained.

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Abstract

The invention discloses ultraviolet-thermal dual-cured resin, anti-welding ink containing the resin, and an application of the resin. The resin is obtained as follows: multifunctional epoxy resin containing two or more pieces of epoxy acetylene and monocarboxylic acid containing an unsaturated group are subjected to ring-opening addition to obtain a middle product, and the middle product and saturated or unsaturated anhydride are subjected to ring-opening addition; the equivalent weight of an epoxy group is 0-1,000g/eq; the equivalent weight of vinyl is 0-1,000g/eq. A printed circuit board is coated with the anti-welding ink in a silk-screen printing mode to form a welding resistant coating layer and then the welding resistant coating layer is subjected to ultraviolet exposure, development and thermal curing. The ultraviolet-thermal dual-cured resin disclosed by the invention can realize the ultraviolet-thermal dual-curing, and is excellent in physical and chemical performance, low in toxicity, and environmentally-friendly; the anti-welding ink containing the resin is high in photo-electric sensitivity; the ultraviolet-thermal-cured coating layer is high in precuring operation tolerance level, soldering heat resistance, adhesive force and chemical resistance.

Description

technical field [0001] The invention relates to a resin, in particular to a UV-light thermal dual-curing resin containing epoxy and vinyl groups, a solder resist ink containing the resin, and the application of the solder resist ink in circuit board printing, belonging to organic Technical fields of polymer synthesis and printing materials. Background technique [0002] In order to ensure that electrical components are insulated during soldering and electronic products are not affected by external environmental changes during use, it is necessary to coat a permanent protective layer on the surface of the printed circuit board (PCB), that is, solder resist ink or solder resist ink. The curing agent of traditional solder resist ink is mostly epoxy resin composition, and there are many kinds of epoxy resins. Among them, triglycidyl isocyanurate (TGIC) is a heterocyclic polyepoxide compound, because of its excellent heat resistance , Weather resistance, high temperature resista...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/17C09D11/10C09D11/101H05K1/02
Inventor 安丰磊朱民朱东冯玉进刘仁周立国
Owner JIANGSU KUANGSHUN PHOTOSENSITIVITY NEW MATERIAL
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