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Application method of ultrasonic vibration-assisted polishing device for superhard material microstructure surface

A superhard material, ultrasonic vibration technology, applied in the field of high-efficiency and high-precision polishing of ceramic superhard linear microstructure surfaces, can solve the problem of uneven surface quality, easy damage at the sharp point of the microstructure, and low efficiency of mechanical polishing methods, etc. problems, to achieve the effect of improving surface accuracy, increasing three-body wear, and reducing friction.

Active Publication Date: 2016-08-31
HARBIN INST OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The purpose of the present invention is to provide an ultrasonic vibration-assisted polishing device for the microstructure surface of superhard materials and its use method in order to solve the problems of low efficiency of the mechanical polishing method, uneven processing surface quality and easy damage of the sharp microstructure

Method used

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  • Application method of ultrasonic vibration-assisted polishing device for superhard material microstructure surface
  • Application method of ultrasonic vibration-assisted polishing device for superhard material microstructure surface
  • Application method of ultrasonic vibration-assisted polishing device for superhard material microstructure surface

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specific Embodiment approach 1

[0021] Specific Embodiment 1: The ultrasonic vibration-assisted polishing device for superhard material microstructure surface in this embodiment consists of a precision grinder workbench 1, a dynamometer 2, an ultrasonic vibration workbench 3, a superhard material profiling processing tool 5, and an optical microscope 6 It is composed of the spindle 7 of the precision grinding machine, the dynamometer 2 is located on the upper surface of the left side of the precision grinding machine table 1, the optical microscope 6 is located on the upper surface of the right side of the precision grinding machine table 1, and the ultrasonic vibration table 3 is located on the upper surface of the dynamometer 2 On the sensor and fixedly connected with it, so as to collect the change of the vertical polishing force in the processing area, the superhard material workpiece 4 is fixed on the end of the tool head 3-1 front end of the ultrasonic vibration table 3, and the tool head 3-1 follows the...

specific Embodiment approach 2

[0022] Embodiment 2: This embodiment is different from Embodiment 1 in that: the superhard material workpiece is tungsten carbide, silicon carbide or silicon nitride. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0023] Specific embodiment three: The method of using the ultrasonic vibration-assisted polishing device for the superhard material microstructure surface in this embodiment is realized through the following steps:

[0024] 1. Install the diamond profiling grinding wheel 5-1 on the precision grinding machine spindle 7, fix the superhard material workpiece 4 to the front end of the tool head 3-1 of the ultrasonic vibration table 3, and apply one-dimensional ultrasonic vibration. The three-dimensional vibration direction is the same as the feeding direction of the tool head 3-1, the rotational speed of the diamond profiling grinding wheel 5-1 is controlled to be 2000rpm-4000rpm, and the feeding speed of the precision grinding machine table 1 is controlled to be 0.2mm / min-2mm / min, and the alignment is completed. Precision grinding of superhard material workpiece 4;

[0025] 2. The diamond profiling grinding wheel 5-1 is removed, the profiling polishing wheel 5-2 is installed on t...

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Abstract

The invention relates to an ultrasonic vibration auxiliary polishing device and a using method thereof, in particular to an ultrasonic vibration auxiliary polishing device for a super-hard material micro-structure surface and a using method of the ultrasonic vibration auxiliary polishing device. The ultrasonic vibration auxiliary polishing device for the super-hard material micro-structure surface and the using method of the ultrasonic vibration auxiliary polishing device aim at solving the problems that a mechanical polishing method is low in efficiency, the finished surface quality is nonuniform, and micro-structure sharp positions are prone to damage. The ultrasonic vibration auxiliary polishing device is composed of a precision grinder workbench, a forcemeter, an ultrasonic vibration workbench, a super-hard material profiling machining tool, an optical microscope and a precision grinder spindle. The using method of the ultrasonic vibration auxiliary polishing device comprises the steps of conducting grinding, conducting polishing and machining on all micro grooves in sequence. According to the ultrasonic vibration auxiliary polishing device for the super-hard material micro-structure surface and the using method of the ultrasonic vibration auxiliary polishing device, micro-structure shape precision obtained after grinding is ensured, the sharp portions of the micro-structure surface are not damaged, the polishing efficiency of super-hard materials is effectively improved, and the high-quality micro-structure surface can be efficiently obtained. The ultrasonic vibration auxiliary polishing device for the super-hard material micro-structure surface and the using method of the ultrasonic vibration auxiliary polishing device are used for precision polishing for the super-hard micro-structure surface.

Description

technical field [0001] The invention relates to an ultrasonic vibration-assisted polishing device and a method for using the same, in particular to an ultrasonic-vibration-assisted polishing device for a linear microstructure surface and a method for using the same, which is suitable for high-efficiency and high-precision polishing of ceramic superhard linear microstructure surfaces. Background technique [0002] Microstructured surfaces refer to microstructured surfaces with regular periodic arrays and high aspect ratio geometries, and can realize specific functions such as optics, mechanics, physics, and biology. Optical components with microstructured surfaces have the advantages of small size, low power consumption, portability and good integration, and have become key components in the manufacture of tiny optoelectronic and communication products. [0003] Generally, the method suitable for mass production of microstructured optical components is replication technology,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B1/04
CPCB24B1/04
Inventor 孙智源赵清亮郭兵邹程刘晓亮
Owner HARBIN INST OF TECH
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