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Low-temperature hot stamping anodized aluminum thermal transfer adhesive and preparation method thereof

An anodized aluminum and thermal transfer technology, applied in the direction of adhesives, adhesive types, adhesive additives, etc., can solve problems such as waste of energy, damage to hot stamping substrates, stretching deformation of PET base film layers, etc., to save energy consumption , wear resistance and the effect of improving the definition of hot stamping

Active Publication Date: 2016-04-13
ZHEJIANG HENGFENG PACKING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the temperature of the plate roller is too high, it will easily cause the PET base film layer of the anodized aluminum to be stretched and deformed, and it will damage the hot stamping substrate, affect the gloss of the hot stamping, and waste a lot of energy, which limits the use and promotion of the anodized aluminum material.

Method used

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  • Low-temperature hot stamping anodized aluminum thermal transfer adhesive and preparation method thereof
  • Low-temperature hot stamping anodized aluminum thermal transfer adhesive and preparation method thereof
  • Low-temperature hot stamping anodized aluminum thermal transfer adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] The low-temperature hot stamping anodized aluminum thermal transfer adhesive provided by the present invention and its preparation method, raw materials and proportioning (parts by weight):

[0019]

[0020] Among them, the selected ultra-low softening point polyamide resin is a mixture of polycaprolactam, polyhexamethylene adipamide, and polyhexamethylene sebacamide, with a molecular weight of 5000g / mol and a softening point of 90°C;

[0021] The selected acrylate copolymer emulsion is a terpolymer (P(BA-AA-MMA)) emulsion of butyl acrylate, acrylic acid and methyl methacrylate, and the molar ratio of BA in the copolymer is 85%;

[0022] Preparation:

[0023] (1) Put alcohol and ethyl acetate into the reaction kettle according to the formula requirements, and heat to 40°C for stirring;

[0024] (2) Put cellulose acetate, ultra-low softening point polyamide resin and polyvinyl butyral into the reaction kettle in proportion, and mechanically stir for 1.5 hours to comp...

Embodiment 2

[0030] Raw materials and proportioning (parts by weight):

[0031]

[0032] Among them, the ultra-low softening point polyamide resin selected is a mixture of polyhexamethylene adipamide, polyhexamethylene sebacamide, polydecanediamine sebacate, and polydodecamide, with a molecular weight of 4000g / mol, softening The point is 110°C;

[0033] The selected acrylate copolymer emulsion is a terpolymer (P(BA-AA-MMA)) emulsion of butyl acrylate, acrylic acid and methyl methacrylate, and the molar ratio of BA in the copolymer is 80%;

[0034] The selected alcohol is tapioca alcohol.

[0035] Preparation:

[0036] (1) Put alcohol and ethyl acetate into the reaction kettle according to the formula requirements, and heat to 50°C for stirring;

[0037] (2) Put cellulose acetate, ultra-low softening point polyamide resin and polyvinyl butyral into the reaction kettle in proportion, and mechanically stir for 2 hours to completely dissolve the resin;

[0038] (3) Add the acrylate copo...

Embodiment 3

[0043] Raw materials and proportioning (parts by weight):

[0044]

[0045] The ultra-low softening point polyamide resin selected is a mixture of polycaprolactam, polyhexamethylene adipamide, polyhexamethylene sebacamide, and polydodecamide, with a molecular weight of 4000g / mol and a softening point of 65°C;

[0046] The selected acrylate copolymer emulsion is a terpolymer (P(EA-AA-MMA)) emulsion of ethyl acrylate, acrylic acid and methyl methacrylate, and the molar ratio of EA in the copolymer is 90%;

[0047] Preparation:

[0048] (1) Put alcohol and ethyl acetate into the reaction kettle according to the formula requirements, and heat to 30°C for stirring;

[0049] (2) Put cellulose acetate, ultra-low softening point polyamide resin and polyvinyl butyral into the reaction kettle in proportion, and mechanically stir for 1.5 hours to completely dissolve the resin;

[0050] (3) Add the acrylate copolymer emulsion into the reaction kettle according to the recipe requireme...

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Abstract

The invention discloses low-temperature stamping electrochemical aluminum heat transfer gum, which is characterized by comprising the following components in parts by weight: 10-25 parts of ultra-low softening point polyamide resin, 1-10 parts of cellulose acetate, 1-8 parts of polyvinyl butyral, 15-40 parts of acrylate copolymer emulsion, 20-40 parts of ethyl alcohol and 20-40 parts of ethyl acetate. The preparation method comprises the following steps: firstly, feeding the ethyl alcohol and the ethyl acetate to a reaction kettle according to the requirements of the formula, heating to 30-50 DEG C to agitate; feeding the cellulose acetate, the ultra-low softening point polyamide resin and the polyvinyl butyral to the reaction kettle to agitate according to the ratio; feeding the acrylate copolymer emulsion to the reaction kettle according to the requirements of the formula; carrying out a coating test after a sizing material is cooled; adding proper parts of flatting agents according to the test result; measuring the solid content and adjusting the theoretical value. The low-temperature stamping electrochemical aluminum heat transfer gum obtained by the method is energy-saving and consumption-reducing, and high in stamping glossiness and definition.

Description

technical field [0001] The invention relates to a thermal transfer adhesive, in particular to an anodized aluminum thermal transfer adhesive capable of hot stamping at low temperature and a preparation method thereof. Background technique [0002] With the continuous development of the printing industry, the application of anodized aluminum is becoming more and more extensive. The melting temperature of the resin system and the boiling point of the solvent system in the adhesive layer formula of traditional anodized aluminum are relatively high, so the temperature of the plate roll must reach 110°C-170°C during use, so that the anilox information of the metal platen can be completely , Completely transferred on the substrate. However, if the temperature of the plate roller is too high, it will easily cause the PET base film layer of the anodized aluminum to be stretched and deformed, and will damage the hot stamping substrate, affect the gloss of the hot stamping, and waste...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J133/08C09J177/00C09J101/12C09J129/14C09J11/08
Inventor 周晋祝华王靖靖林雪峰陈建华
Owner ZHEJIANG HENGFENG PACKING
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