Copper-based composite heat conduction material and manufacturing method thereof

Abstract

The invention relates to a heat conduction material and a manufacturing method thereof, in particular a copper-based composite heat conduction material and a manufacturing method thereof. The heat conduction material includes a copper base material; the surface of one side or two sides of the copper base material is provided with a mixed metal material; and the mixed metal material is a eutectic mixed metal material composed of 6 to 12% silver, 8 to 3% gallium and 80 to 91% tin. The method includes the following steps that: the 6 to 12% silver, the 8 to 3% gallium and the 80 to 91% tin are heated and mixed so as to form a mixed metal liquid; the mixed metal liquid is plated on the surface of the sheet-shaped copper base material; and the copper base material of the surface is plated with the mixed metal liquid is heated and is subjected to eutectic combination, and is cooled. With the copper-based composite heat conduction material of the invention adopted, large assembly clearance, thermal resistance increase, and interfacial contact thermal resistance reduction of an electronic device, which are caused by frequent thermal expansion and cold contraction when common composite materials are used, can be avoided; an electron flow transfer path in a metal material heat conduction process can be shortened, and heat transfer rate can be increased, and possibility of liquidation or deformation is low, and the stability of heat transfer can be ensured.

Description

technical field [0001] The invention relates to a heat-conducting material and a manufacturing method thereof, in particular to a copper-based composite heat-conducting material and a manufacturing method thereof. [0002] Background technique [0003] When two solid surfaces are in contact with each other, due to the existence of microscopic surface roughness, the actual contact only occurs on some discrete micro-protrusions on the contact surface, and the actual contact area only accounts for a very small part of the nominal contact area. This causes incomplete contact at the interface, which eventually leads to the shrinkage of the heat flow, causing a step change in the temperature between the two contacting solids, and the resulting thermal resistance is the contact thermal resistance. Contact thermal resistance is an important parameter in the design of electronic devices, such as IC design of nanostructures in microelectronic packaging, surface coating materials, the...

AI Technical Summary

Problems solved by technology

In order to solve this problem, products such as thermal paste, thermal silica gel sheet, red copper, composite metal materials, thermal conductive silicone grease and other products that reduce the contact thermal resistance by filling the gap between the two contact surfaces gradually appear in the market. The general thermal conductivity is 1.5w / mk~4w / mk, among them, the effect of thermal conductive silicone grease is better, but it is expensive due to the doping of precious metal components; thermal conductive paste and other products are prone to material aging with the increase of use time. Prone to failure after shrinkage

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