The invention relates to a heat conduction material and a manufacturing method thereof, in particular a
copper-based composite heat conduction material and a manufacturing method thereof. The heat conduction material includes a
copper base material; the surface of one side or two sides of the
copper base material is provided with a
mixed metal material; and the
mixed metal material is a eutectic
mixed metal material composed of 6 to 12% silver, 8 to 3%
gallium and 80 to 91%
tin. The method includes the following steps that: the 6 to 12% silver, the 8 to 3%
gallium and the 80 to 91%
tin are heated and mixed so as to form a mixed
metal liquid; the mixed
metal liquid is plated on the surface of the sheet-shaped copper base material; and the copper base material of the surface is plated with the mixed
metal liquid is heated and is subjected to eutectic combination, and is cooled. With the copper-based composite heat conduction material of the invention adopted, large
assembly clearance,
thermal resistance increase, and interfacial contact
thermal resistance reduction of an electronic device, which are caused by frequent
thermal expansion and cold contraction when common composite materials are used, can be avoided; an
electron flow transfer path in a metal material heat conduction process can be shortened, and
heat transfer rate can be increased, and possibility of liquidation or deformation is low, and the stability of
heat transfer can be ensured.