The invention discloses an anti-overload potting process for a missile-borne product, and belongs to the technical field of missile-borne. The anti-overload potting process is characterized by comprising the following steps that a, caulking is carried out on a gap on the missile-borne product by using silicon rubber, and preparation of an epoxy resin AB type potting adhesive is started after the gap is caulked; b, the prepared epoxy resin AB type potting adhesive is poured into a needle cylinder; c, the missile-borne product is fixed on a vibration meter, the vibration meter is started, and the epoxy resin AB type potting adhesive is injected to the interior of the missile-borne product at a constant speed; and d, after the potting amount and the potting state are verified to meet the requirements, the missile-borne product is taken down from the vibration meter and transferred into a high-temperature box for placement, the missile-borne product is taken out after the epoxy resin AB type potting adhesive is completely solidified and hardened, finally, the silicone rubber for caulking the missile-borne product is cleaned, and the potting of the missile-borne product is completed. According to the anti-overload potting process, the whole potting operation is simple and easy to implement, the potting efficiency can be effectively improved, the potting uniformity can be kept in the potting process, and the potting quality and the potting effect are improved.