Fluorine-modified epoxy resin base film for thin-film solar cells and preparation method thereof
An epoxy resin-based film, solar cell technology, applied in circuits, electrical components, semiconductor devices, etc., can solve problems such as low solar cell efficiency, and achieve the effects of improving overall efficiency, preventing light escape, and improving light absorption efficiency
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Publication Date
- 2016-02-17
- Estimated Expiration
- Not applicable · inactive patent
Abstract
Description
technical field
[0001] The invention relates to a fluorine-modified epoxy resin base film for a flexible or thin-film solar cell and a preparation method thereof. By using the film to encapsulate the light-incident surface of the flexible or thin-film solar cell, the efficiency of the flexible or thin-film solar cell can be directly improved . Background technique
[0002] Among the projects of effective utilization of solar energy: photovoltaic utilization is the fastest growing and most dynamic research field in recent years. Generally, the production of solar cells is mainly based on semiconductor materials, which use photoelectric materials to absorb light energy and generate photoelectric conversion reactions to generate electricity. According to the different materials used, solar cells can be divided into: 1. Silicon solar cells; 2. Solar cells made of inorganic salts such as gallium arsenide III-V compounds, cadmium sulfide, copper indium selenide and other multi-co...
Examples
Embodiment 1
[0028] (1) Prepare 8Kg of perfluoroalkylethyl acrylate with epoxy groups (resin solid content is 10%), 20KgN,N-dimethylformamide, 10Kg toluene to prepare a solution, and epoxy resin base solution; 61.9999Kg tetrahydrofuran was stirred and blended uniformly at 0°C with an emulsifier;
[0029] (2) Add 0.0001Kg nano-aluminum powder to the above solution at room temperature and mix it with an emulsifier, and use ultrasonic treatment to obtain a uniformly mixed colloidal blend;
[0030](3) Import the above blend into the screw mixing extruder for blending and extrusion, the temperature is controlled at 80-90 ° C, the extruded product is filtered through a 150-mesh filter, the pressure difference between the inlet and outlet of the metering pump is 1 MPa, metered, extruded, and cast A film thickness of 100 UM, 10 degrees air cooling, 2 times the drafting ratio drawing, pulling, coiling and other processes, to obtain a flexible or thin-film epoxy resin base film for solar cells.
[...
Embodiment 2
[0033] (1) Mix 9Kg of perfluoroalkyl ethyl acrylate with epoxy groups containing nano-montmorillonite (resin solid content is 8%), use 10KgN,N-dimethylformamide, 10Kg acetone, 10Kg Tetrahydrofuran and 10Kg butyl acetate were prepared into a solution; the epoxy resin-based solution; 50.9Kg tetrahydrofuran was stirred and blended evenly at a temperature of 140°C with an emulsifier;
[0034] (2) Add 0.1Kg of nano-aluminum powder to the above solution at room temperature and mix it with an emulsifier, and use ultrasonic treatment to obtain a uniformly mixed colloidal blend;
[0035] (3) Import the above blend into a screw mixing extruder for blending and extrusion, the temperature is controlled at 80°C, the extrudate is filtered through a 150-mesh filter, the pressure difference between the inlet and outlet of the metering pump is 1MPa, metered and extruded, and the cast film thickness 100UM, 10 degrees air cooling, 2 times the drafting ratio, drawing, pulling, coiling and other p...
Embodiment 3
[0038] (1) Mix 10Kg of hexafluorobutyl methacrylate epoxy resin containing nano-powder (resin solid content is 5%) with 10KgN,N-dimethylformamide, 10Kg benzene, 10Kg tetrahydrofuran, 10Kg butyl acetate Prepare a solution, stir and blend the epoxy resin-based solution and 49.999 benzene with an emulsifier at a temperature of 100°C;
[0039] (2) Add 0.001Kg nano-aluminum powder to the above solution at room temperature and mix it with an emulsifier, and use ultrasonic treatment to obtain a uniformly mixed colloidal blend;
[0040] (3) Import the above blend into a screw mixing extruder for blending and extrusion, the temperature is controlled at 90°C, the extrudate is filtered through a 150-mesh filter, the pressure difference between the inlet and outlet of the metering pump is 1MPa, metered and extruded, and the cast film thickness 100UM, 10 degrees air cooling, 2 times the drafting ratio, drawing, pulling, coiling and other processes to obtain an epoxy resin base film for fle...