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High-stability conductive slurry and preparation method thereof

A conductive paste, high stability technology, used in conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc., can solve the problems of conductive paste transportation and storage instability, and achieve extended use and shelf life, good compatibility, abundant and easy-to-obtain raw materials

Inactive Publication Date: 2014-07-02
北京中科纳通科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the unstable problem of the conductive paste in the prior art during preparation, transportation and storage, the present invention provides a high-stability conductive paste and a preparation method thereof. By adding a stabilizer, the stability of the conductive paste is improved. Stability, prolong the use and storage life of conductive paste

Method used

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  • High-stability conductive slurry and preparation method thereof
  • High-stability conductive slurry and preparation method thereof
  • High-stability conductive slurry and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] This example is a blank experiment, which is prepared by a traditional method, except that the conventional RFID antenna conductive silver paste is prepared without adding the stabilizer of the present invention. Contains only silver powder, binders and solvents.

[0028] Its preparation method is as follows:

[0029] According to the mass ratio of each component in the conductive paste, weigh 9.5g of polyacrylic acid resin and add it to 10.0g of ethylene glycol butyl ether, stir and disperse for 30min; then add 80.0g of micron silver powder with an average particle size of 7μm, and continue stirring until uniformly mixed; finally use a three-roll mill to grind and mix until the particle size of the slurry is below 5 μm. Printed onto TESLIN film by screen printing (250 mesh). The microscope photo of the circuit layer is as figure 1 Shown; Under the condition of room temperature (25 ℃), use American Brookfield rotational viscometer to measure its viscosity, make speci...

Embodiment 2

[0031] According to the mass ratio of each component in the conductive paste, 8.5g of polyacrylic resin and 1.0g of polyethyleneimine were successively weighed and added to 10.0g of ethylene glycol butyl ether, mechanically stirred and dispersed for 30min; then 80.0g of average particle size was added Micron silver powder with a diameter of 7 μm, continue to stir until the mixture is uniform; finally use a three-roll mill to grind and mix until the particle size of the slurry is below 5 μm. Prepare the circuit layer on the printed TESLIN film by screen printing (250 meshes), and the micrograph of the circuit layer is as follows figure 2 shown. Under the condition of room temperature (25 ℃), use the American Brookfield rotational viscometer to measure the viscosity change, make the specific viscosity and time relationship diagram, such as image 3 shown

[0032] Compare figure 1 and figure 2 , it is obviously observed that the conductive paste after adding the stabilizer ...

Embodiment 3

[0035] According to the mass ratio of each component in the conductive paste, 8.0g of epoxy resin (E-51) and 1.5g of sodium dodecylbenzenesulfonate were successively weighed and added to 10.0g of terpineol, and dispersed by mechanical stirring for 30min; Then add 80.0 g of nano-silver powder with an average particle size of 10 nm, and continue to stir until the mixture is uniform; finally use a three-roll mill to grind and mix until the particle size of the slurry is below 3 μm. Prepare the circuit layer by screen printing (400 orders) on the printed PET film, the photomicrograph of the circuit layer has no substantial difference with the photo of the circuit layer prepared in Example 2, evenly distributed on the substrate, and the appearance is smooth and flat; at room temperature (25 ℃) under the condition, use the U.S. Brookfield rotational viscometer to measure its viscosity change, obtain specific viscosity and time graph and the figure that embodiment 2 obtains has no ess...

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Abstract

The invention discloses a high-stability conductive slurry. The conductive slurry comprises silver powder, a blinder, a stabilizer and a solvent. The silver power can be micrometer silver powder, nanometer silver powder or a combination of the two in any proportions; through adding the stabilizer, the slurry deposition layering phenomenon generated during the preparation, transportation and storage process of the conductive slurry, and the consistency of the conductive slurry, the distribution uniformity and flatness of the a conductive slurry on a base material are ensured; and the stability of the conductive slurry is effectively enhanced, the application and storage life of the conductive slurry is prolonged, and the high-stability conductive slurry and the preparation method are widely applied to conductive slurry fields such as an RFID antenna, a touch screen line, a flexible printed circuit (FPC), a film switch, a solar battery, a printed circuit board and the like.

Description

technical field [0001] The invention relates to the application field of conductive paste, in particular the invention relates to a highly stable conductive paste and a preparation method thereof. Background technique [0002] In recent years, conductive paste, as a basic electronic material with specific functions, has been widely used in printed circuit boards, solar cells, surface mount, RFID radio frequency antennas, touch screen circuits, flexible printed circuit FPC and other electronic circuit fields. The stability of conductive paste during preparation, transportation and storage cannot be ignored in industrial production. Poor stability of the conductive paste, uneven distribution of effective substances in the conductive paste, rough surface of the printed electronic circuit, poor adhesion between conductive particles, resulting in poor electrical conductivity of the circuit; solid substance precipitation occurs during the transfer, transportation and storage of th...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B13/00
Inventor 邱雄鹰张兴业吴丽娟宋延林王述强司国丽袁恩鹏
Owner 北京中科纳通科技有限公司
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