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Silver powder, method for producing silver powder, and conductive paste

A manufacturing method and technology of silver powder, applied in the direction of conductive materials, conductive materials, cable/conductor manufacturing, etc., can solve the problem of sinterability and other problems

Inactive Publication Date: 2014-07-09
SUMITOMO METAL MINING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Even when silver salts, especially chlorine, are present in a trace amount of, for example, about 100 ppm, sinterability becomes a problem

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] 2918 g of silver chloride (manufactured by Sumitomo Metal Mining Co., Ltd.) was added to 40 L of 25% ammonia water maintained at 36° C. in a warm bath at 38° C. while stirring to prepare a silver complex solution, and the obtained silver complex The compound solution was maintained at 36°C in a warm bath.

[0063] On the other hand, 1220 g of ascorbic acid (manufactured by Kanto Chemical Co., Ltd., reagent) as a reducing agent was dissolved in 14 L of pure water at 36° C. to prepare a reducing agent solution.

[0064] Next, 106.8 g of polyvinyl alcohol as a water-soluble polymer (manufactured by KURARAY CO LTD, PVA205) was dissolved in 550 ml of pure water at 36° C., and then mixed into the reducing agent solution. 1.2 g of oxyethylene-added quaternary ammonium salt (manufactured by Croda Japan K.K., trade name Cirrasol G-265, 0.054% by mass relative to the amount of silver in the silver complex solution) was mixed into the reducing agent solution.

[0065] For the sil...

Embodiment 2

[0072] In Example 2, the cationic surfactant was changed to a tertiary amine salt (Nymeen L207 manufactured by NOF Corporation), and silver particles were obtained and evaluated according to Example 1 except that the content of chlorine was 0.0021% by weight. . In addition, the average particle diameter DS of silver powder was 1.01 micrometers. Moreover, the volume-cumulative average particle diameter D50 which disperse|distributed silver powder in isopropanol and measured by the laser diffraction scattering method was 2.0 micrometers. In addition, the specific surface area measured by the BET method was 0.45m 2 / g.

Embodiment 3

[0074] In Example 3, the cationic surfactant was changed to a polyamine compound (BYK9076 manufactured by BYK Chemical Co., Ltd.) having two or more amino groups in the molecule, and it was added as an ethanol solution, and obtained according to Example 1 except that Silver particles were obtained and evaluated, and the content of chlorine was 0.0015% by weight. In addition, the average particle diameter DS of silver powder was 0.98 micrometers. Moreover, the volume-cumulative average particle diameter D50 which disperse|distributed silver powder in isopropanol and measured by the laser diffraction scattering method was 2.0 micrometers. In addition, the specific surface area measured by the BET method was 0.46m 2 / g.

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Abstract

The present invention provides a method for producing silver powder having a low chlorine content, and a conductive paste containing the resulting silver powder. When a reducing agent solution is mixed with a solution containing a silver complex, which has been obtained as a result of dissolution of silver chloride by a complexing agent, and the silver complex is thereby reduced to obtain silver powder, an organic compound having hydrophilic groups that form cations when ionized in water is added to the reducing agent solution and / or the solution containing the silver complex such that preferential adsorption of the organic compound which takes priority over chlorine on the surface of the silver particles is promoted and the adsorption of the chlorine is inhibited.

Description

technical field [0001] The present invention relates to silver powder, a method for producing the silver powder, and a conductive paste containing the silver powder. The paste is used to form wiring layers, electrodes, etc. of electronic devices. [0002] This application claims priority based on Japanese Patent Application No. Japanese Patent Application No. 2011-252922 for which it applied in Japan on November 18, 2011, and this application is referred, and is used for this application. Background technique [0003] Silver pastes such as resin-type silver pastes and calcined-type silver pastes are widely used in the formation of wiring layers, electrodes, and the like in electronic devices. Conductive films such as wiring layers and electrodes are formed by applying or printing the silver paste, followed by heat curing or heat firing. [0004] For example, a resin-type silver paste is composed of silver powder, resin, curing agent, solvent, etc., and the resin-type silve...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/24B22F1/02H01B1/00H01B1/22H01B5/00H01B13/00B22F1/00B22F1/102B22F1/107
CPCB22F9/24H01B1/02B22F2301/255H01B1/22B22F1/102B22F1/107B22F1/00
Inventor 寺尾俊昭石田荣治
Owner SUMITOMO METAL MINING CO LTD
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