Jig for manufacturing capacitor element and method for manufacturing capacitor element

Abstract

Provided is a jig for manufacturing a capacitor element which allows accurate control of the immersion position for an anode body in a process liquid and facilitates heat treatment when heat treatment is required during manufacturing the capacitor element. The jig includes a first substrate (11), a second substrate (12) that is arranged parallel to the first substrate along the planar bottom surface thereof, and a plurality of sockets (1) mounted on the bottom surface of the second substrate. Each of first electrical connection terminals (41) on the bottom surface of the first substrate (11) is electrically connected to an electric source that supplies current to the anode body of a capacitor. Second electrical connection terminals (42) on the upper surface of the second substrate (12) are electrically connected to the sockets (1). When the second substrate (12) is stacked on and arranged parallel to the bottom surface of the first substrate (11), the first electrical connection terminals (41) come into contact with the second electrical connection terminals (42) such that respective first and second electrical connection terminals are electrically connected. The connection allows the sockets (1) to be electrically connected to the electric source. The sockets (1) have an outlet (37) for electrically connecting thereto the lead of the anode body of a capacitor. The outlet (37) opens downwardly from the second substrate (12).

Description

technical field [0001] The present invention relates to a capacitive element manufacturing jig used, for example, when manufacturing capacitive elements used in solid electrolytic capacitors, and a method of manufacturing a capacitive element using the capacitive element manufacturing jig. Background technique [0002] Capacitors around the CPU (central processing unit) used in personal computers are required to have high capacity and low ESR (equivalent series resistance) in order to suppress voltage fluctuations and suppress heat generation when high ripples pass through. ). As such capacitors, aluminum solid electrolytic capacitors, tantalum solid electrolytic capacitors, and the like are used. These solid electrolytic capacitors are known to include one electrode (anode body), a dielectric layer formed on the surface of the electrode, and another electrode (usually a semiconductor layer) formed on the dielectric layer, the one electrode including microscopic A sintered...

AI Technical Summary

Problems solved by technology

[0007] In addition, if the immersion position (height) of the anode body when immersed in the treatment liquid is not controlled with high precision, for example, the formation position (especially height) of the semiconductor layer formed on the anode body is not uniform for each product. of

The capacitor formed by the semiconductor layer exceeding the certain position in the anode body has a high probability of becoming a defective product, which greatly reduces the yield

Images