Mask dust collection device

Abstract

The invention relates to a mask dust collection device which comprises a closed cavity, a rotating shaft, a rotating bracket, a clamp, a nitrogen spray nozzle and a gas suction pipeline, wherein a mask is horizontally suspended at the upper side inside the closed cavity through the suspending bracket and can rotate around the rotating shaft of the suspending bracket; the nitrogen spray nozzle with a flat spray orifice is used for cleaning and purging the surface of the mask from the lower side of the mask, then blown dust particles and redundant nitrogen are discharged through the gas suction pipeline, and the nitrogen spray nozzle can be translated to the edge part of the mask from a central part below the mask. According to the structure disclosed by the invention, gas flow which is mingled with dust particles is prevented from generating secondary pollution on the mask and the blind area is prevented since nitrogen can be blown to the whole surface of the mask. The mask dust collection device can be used for comprehensively and thoroughly cleaning dust particles on the surface of the mask and lowers nitrogen consumption.

Description

technical field [0001] The invention relates to the technical field of integrated circuit manufacturing, and more specifically relates to a mask plate dust removal structure in the semiconductor device manufacturing process. Background technique [0002] With the development of modern semiconductor manufacturing industry, photolithography plays an increasingly important role in the chip manufacturing process. Photolithography technology mainly uses a photolithography machine to transfer the pattern on the mask to the silicon wafer. The mask contains the chip array of the entire silicon wafer. The surface of the mask must be kept clean to achieve multiple repeated exposures. To form perfect circuit components on silicon wafers, nitrogen purge is usually used to remove dust particles attached to the surface of the mask. [0003] For the mask plate dust removal device, the mainstream equipment in the industry is to blow the upper surface of the fixed mask plate in a closed cav...

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Problems solved by technology

[0004] However, in actual use, this type of device has some disadvantages: the gas is injected from above the mask, while the exhaust pipeline is below the mask, which will easily cause dust particles to fall back to the mask after encountering the cavity wall The front and even the back will cause secondary pollution; the nitrogen nozzle and the mask arranged above are fixed, and the cleaning and purging of the entire surface of the mask cannot be realized; moreover, the exhaust capacity of the exhaust pipeline is limited, It cannot be guaranteed that all the pollutants blown down will be completely removed; and the nozzles of the existing nitrogen nozzles arranged above are arranged in a circular shape, such as figure 2 , figure 2 It is a schematic diagram of the circular nozzle of the nitrogen nozzle arranged above in the prior art; figure 2 When the medium-round nozzle removes larger particles, it is easy to cause the large particles to break into several small particles. Although the larger particles are removed, new small particle pollution is generated around the large particles.

[0006] However, those skilled in the art know that in the prior art, the fixed mask surface is purged through a fixed nitrogen nozzle arranged above, even if the flow rate of nitrogen gas for purging is increased or the nitrogen purging time is prolonged and purged repeatedly, It is also impossible to ensure that the particles that have been purged are completely removed by the exhaust pipe, nor can it be guaranteed that the nitrogen used for purging can cover the entire surface of the mask, resulting in a decrease in dust removal efficiency and an increase in the cost of nitrogen consumption.

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