Chemical copper plating liquid as well as preparation method and chemical copper plating method thereof

A technology of electroless copper plating and copper salt, which is applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problems of poor stability and low activity of electroless plating solution, achieve improved activity and stability, reduce Reaction potential, the effect of ensuring long-term stability

Active Publication Date: 2014-09-03
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0015] The invention solves the technical problems of poor stability and low activity of the electroless plating solution in the pri

Method used

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preparation example Construction

[0031] The present invention also provides the preparation method of described electroless copper plating liquid, comprises first copper salt, complexing agent, stabilizing agent, reducing agent, surfactant, imidazoquinolinic acid are respectively dissolved in water to prepare respective aqueous solutions, and then The copper salt aqueous solution is first mixed with the complexing agent aqueous solution, and then mixed with other aqueous solutions to obtain the electroless copper plating solution.

[0032] As mentioned above, the electroless copper plating solution needs to be guaranteed to be in an alkaline environment, so it is necessary to add a pH regulator to adjust the pH value of the system. Preferably, after first mixing the copper salt aqueous solution and the complexing agent aqueous solution, then adding a pH regulator to adjust the pH value of the system, and then adding the aqueous solutions of other components to make the mixing uniform, the chemical provided by ...

Embodiment 1

[0037] Dissolve copper salt, complexing agent, stabilizer, reducing agent, surfactant, and imidazoquinolinic acid in water respectively according to the formula to prepare their respective aqueous solutions, then mix the copper salt aqueous solution with the complexing agent aqueous solution first, and add hydroxide Sodium aqueous solution to adjust the pH value, after stirring for 2 minutes, add the aqueous solution of other components to obtain the electroless copper plating solution S1 of the present embodiment, its formula is: copper sulfate pentahydrate 10g / L, triethanolamine 20g / L, sodium citrate 10g / L, sulfamic acid 5g / L, glyoxylic acid 3g / L, imidazoquinolinic acid 0.003g / L, sodium dodecylbenzenesulfonate 0.005g / L, potassium ferrocyanide 0.01g / L, Bipyridyl 0.005g / L, sodium hydroxide 10g / L.

Embodiment 2

[0039] Adopt the method identical with embodiment 1 to prepare the electroless copper plating solution S2 of the present embodiment, its formula is: copper chloride dihydrate 10g / L, triethanolamine 25g / L, sodium citrate 12 g / L, sulfamic acid 6g / L, glyoxylic acid 3.5g / L, imidazoquinolinic acid 0.002g / L, sodium lauryl sulfate 0.006g / L, potassium ferrocyanide 0.015g / L, bipyridine 0.007g / L, hydroxide Sodium 15g / L.

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Abstract

The invention provides a chemical copper plating liquid and a preparation method thereof. The chemical copper plating liquid contains a copper salt, a complexing agent, a stabilizing agent, a reductant and a surfactant, and further contains imidazole quinolinic acid. The invention further provides a preparation method of the chemical copper plating liquid and a method for chemical plating by using the chemical copper plating liquid. Due to addition of the imidazole quinolinic acid in a normal chemical copper plating liquid, the activity and the stability of the chemical copper plating liquid provided by the invention are effectively improved, and the chemical copper plating liquid is particularly applicable to an LDS (Laser Direct Structuring) copper plating process and is fast in plating speed.

Description

technical field [0001] The invention belongs to the field of electroless copper plating, and in particular relates to an electroless copper plating liquid, a preparation method thereof and an electroless copper plating method. Background technique [0002] Since Brenner and Ridlell first developed the electroless copper plating technology in the 1940s, after half a century of hard work, this technology has been applied in various fields of the national economy. Electroless copper plating occupies a very important position in electroless plating, and has been widely used in various aspects such as the bottom layer of non-metallic plating, hole metallization of printed boards, and electromagnetic shielding layers of electronic instruments. [0003] At present, most commercial electroless copper plating solutions use formaldehyde as a reducing agent, and there are two basic chemical reactions in the reaction process, namely: [0004] Cu 2+ + 2e → Cu; [0005] 2HCHO + 4OH -...

Claims

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Application Information

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IPC IPC(8): C23C18/40
Inventor 韦家亮林宏业
Owner BYD CO LTD
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