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A kind of preparation method of low temperature copper electronic paste

A copper electronic paste, low temperature technology, applied in cable/conductor manufacturing, circuits, electrical components, etc., can solve the problems of complex process and high cost, and achieve the effect of simple operation process, low price and cost reduction

Active Publication Date: 2016-05-25
中晟嘉特材料科技(苏州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, many scholars at home and abroad improve the surface oxidation resistance of copper electronic paste by silver-plating the surface of copper powder and coating organic film on the surface. The cost is high and the process is relatively complicated.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0021] The preparation method of the low-temperature copper electronic paste of the present invention is specifically implemented according to the following steps:

[0022] Step 1, prepare the mixed solvent of L-ascorbic acid and micron copper powder;

[0023] Mix solid L-ascorbic acid and micron copper powder according to the mass ratio of 2-5:5-8 to make solid powder, then add the solid powder to deionized water, the mass ratio of solid powder to deionized water is 1-5 : 2~7, obtain the mixed solvent of L-ascorbic acid and micron copper powder;

[0024] Step 2, preparing the powder to be coated;

[0025] After mixing the mixed solvent prepared in step 1 with absolute ethanol, centrifuge in a centrifuge at 5500-8500rpm for 10-40 minutes, then let it stand for 15-50 minutes, pour off the supernatant, repeat 2-3 times, and then put it under a nitrogen protective atmosphere Drying treatment to obtain pre-coated copper powder. The drying temperature is 100-150°C, and the dryin...

Embodiment 1

[0031] Step 1, mix solid L-ascorbic acid and micron copper powder according to the mass ratio of 5:5 to make solid powder, then add the solid powder to deionized water, the mass ratio of solid powder to deionized water is 1:2, Promptly obtain the mixed solvent of L-ascorbic acid and micron copper powder;

[0032] Step 2, after mixing the mixed solvent prepared in step 1 with absolute ethanol, stir magnetically at a speed of 8000rpm for 10min, let stand for 30min, pour off the supernatant, and repeat 3 times to remove excess H + , to prevent the copper powder from being oxidized again, and then dry it under a nitrogen protective atmosphere at a drying temperature of 100°C and a drying time of 120 minutes to obtain a pre-coated copper powder;

[0033] Step 3, mix the pre-coated copper powder obtained in step 2 with epoxy resin, polyamide, and aminopropyltriethoxysilane in a mass ratio of 69:20:10:1 and then ultrasonically disperse. The frequency of ultrasonic dispersion is 35KH...

Embodiment 2

[0035] Step 1, mix solid L-ascorbic acid and micron copper powder according to the mass ratio of 2:7 to make solid powder, then add the solid powder to deionized water, the mass ratio of solid powder to deionized water is 3:5, Promptly obtain the mixed solvent of L-ascorbic acid and micron copper powder;

[0036] Step 2, after mixing the mixed solvent prepared in step 1 with absolute ethanol, stir magnetically at a speed of 5500rpm for 20min, let stand for 50min, pour off the supernatant, and repeat 2 times to remove excess H + , to prevent the copper powder from being oxidized again, and then dry it under a nitrogen protective atmosphere at a drying temperature of 150°C and a drying time of 1.5 hours to obtain a pre-coated copper powder;

[0037] Step 3, mix the pre-coated copper powder obtained in step 2 with epoxy resin, polyamide, and aminopropyltriethoxysilane in a mass ratio of 75:16:7:3 and then ultrasonically disperse. The frequency of ultrasonic dispersion is 55KHz f...

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Abstract

The invention provides a method for preparing low-temperature copper electronic paste. The method comprises the specific steps that a mixed solvent of L-ascorbic acid and micron copper powder is prepared; then redundant H+ in the mixed solvent is removed to obtain pre-coated copper powder; at last, the pre-coated copper powder is mixed with epoxy resin, polyamides and APTES and then is subjected to ultrasonic dispersion to obtain the low-temperature copper electronic paste. According to the method for preparing the low-temperature copper electronic paste, the L-ascorbic acid is used as a reducing agent, a dispersing agent and a stabilizing agent to be used for pre-coating the copper powder in a water solution, an oxidation layer on the surface is removed, then a copper powder pre-coated body is obtained through magnetic stirring and standing, and at last the coated copper powder is obtained after drying. The pre-coated micron grade copper powder is used as conductive paste, the epoxy resin is used as a binding agent, the copper electronic paste is prepared with other auxiliary agents added, and the conductive paste used for electronic packaging coating can be obtained through appropriate temperature and time solidification. The preparing process is simple, the production cost is low, and the prepared copper electronic paste is excellent in conductivity and further capable of being stored for a long time.

Description

technical field [0001] The invention belongs to the technical field of electronic paste preparation, and in particular relates to a preparation method of low-temperature copper electronic paste. Background technique [0002] In recent years, the electronic information industry has entered a stage of high-speed development. Electronic paste integrates chemical industry, metallurgy and electronic technology, and has been widely used in modern technology fields such as aerospace and electronic components. [0003] Precious metal electronic pastes have stable electrical and thermal conductivity, but are expensive, have limited resources, and have problems with low electron mobility. At present, the electronic paste used in the market is mainly silver-based electronic paste. However, due to the rising price of silver, the cost of electronic processing enterprises is gradually increasing. Therefore, many electronic processing enterprises urgently need to find a low-cost, easy-to-u...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B13/00
Inventor 苏晓磊刘晓琴贾艳王俊勃屈银虎贺辛亥徐洁付翀刘松涛
Owner 中晟嘉特材料科技(苏州)有限公司