Film, flexible substrate, flexible circuit board and manufacturing method
A manufacturing method and flexible technology, applied in the direction of printed circuit manufacturing, circuits, printed circuits, etc., can solve the problems of increasing the weight and height of the circuit board
Active Publication Date: 2016-03-09
AVARY HLDG (SHENZHEN) CO LTD +1
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Problems solved by technology
In order to solve the problem of electrostatic discharge, the current common method is to weld the static eliminator on the circuit board, but this increases the weight and height of the circuit board
Method used
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[0039] The film provided by the technical solution and its manufacturing method, the flexible substrate and its manufacturing method, the flexible circuit board and its manufacturing method will be further described in detail below with reference to the accompanying drawings and embodiments.
[0040] The method for making the film provided in the first embodiment of the technical solution includes the following steps:
[0041] The first step: preparation of epoxy resin composite material.
[0042] First, provide the raw materials required for the preparation of epoxy resin composite materials, which include carboxyl-terminated polymer modified epoxy resin, ester type thermoplastic polyurethane (Polyestertypethermoplasticpolyurethane, TPU), hardener, catalyst, carbon nanotubes, defoamer and solvent.
[0043]The carboxyl-terminated polymer modified epoxy resin is that the epoxy group at the end of the epoxy resin reacts with the carboxyl group at the end of the carboxyl-termina...
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Abstract
A manufacturing method of film comprises the following steps: carboxyl terminated polymer modified epoxy resin, ester thermoplastic polyurethane, carbon nanotube and a solvent are provided, wherein the carbon nanotube accounts for 2.50-4.00 wt% of mass of raw materials; carboxylation of the carbon nanotube is carried out; the carboxyl terminated polymer modified epoxy resin, the ester thermoplastic polyurethane and the solvent are added into the carboxylated carbon nanotube to be mixed so as to form an epoxy resin composite material; and the epoxy resin composite material is coated on the surface of a release substrate layer and semi-solidified to form the film. The invention also provides the film prepared by the above method, a flexible substrate with the application of the film and a manufacturing method of the flexible substrate, and a flexible printed circuit with the application of the film and a manufacturing method of the flexible printed circuit.
Description
technical field [0001] The invention relates to the field of circuit board production, in particular to a film and a production method thereof, a flexible substrate and a production method thereof, a flexible circuit board and a production method thereof. Background technique [0002] The static charge is generated as a result of material sliding and friction and the movement of electrons. The induced charge generated by the insulator will stay in the contact area. It will discharge in the form of spark (Spark) or arc (Arc). Low electrostatic discharge (Electrostatic Discharge; ESD) is also generated to some extent in ultra-small parts. At present, the development of science and technology has increased the demand for IC manufacturing, electronic assembly and plastic industries, and insulators are prone to accumulate charges to generate electrostatic discharge (ESD). In order to solve the problem of electrostatic discharge, the current common method is to solder the static...
Claims
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IPC IPC(8): C09J7/02C09J163/00C09J175/04C09J11/04H01B1/24H01B5/00H05K1/02H05K3/00H05F3/02
Inventor 何明展
Owner AVARY HLDG (SHENZHEN) CO LTD