Integrated backplane for high heat dissipation solar cell and manufacturing method thereof
A solar cell, high heat dissipation technology, applied in chemical instruments and methods, final product manufacturing, sustainable manufacturing/processing, etc., can solve problems such as reducing energy utilization, achieve good cooling effect, reduce lamination steps, and improve components. The effect of production efficiency
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Embodiment 1
[0019] Coating a thermally conductive polyurethane adhesive (containing 30% aluminum oxide by mass) on both sides of an anodized aluminum substrate with a thickness of 250 microns to form a first thermally conductive adhesive layer and a second thermally conductive adhesive layer with a thickness of 10 microns , bake and cure the adhesive at 80-90°C for 10 minutes, then heat-compress polyvinyl fluoride resin with a thickness of 28 microns on the back of anodized aluminum at 110°C to form a weather-resistant barrier layer, and then place 300 at 150°C A micron-thick polypropylene film containing 10% silicon nitride and 20% aluminum oxide is hot-pressed and laminated to form a high thermal conductivity layer on the front of anodized aluminum, in which the size of silicon nitride is 3-5 μm, and the size of aluminum oxide is 5 μm. -10 μm. Then, at 110°C, the ethylene-vinyl acetate copolymer film with a thickness of 150 microns is heat-compressed and laminated on the surface of the ...
Embodiment 2
[0022] Coating a thermally conductive polyurethane adhesive (containing 30% by mass fraction of alumina) on both sides of a polyethylene terephthalate substrate with a thickness of 250 microns to form a first thermally conductive adhesive layer with a thickness of 10 microns and the second thermally conductive adhesive layer, bake and cure the adhesive at 80-90°C for 10 minutes, and then hot-press and compound polyvinylidene fluoride with a thickness of 28 microns on the back of polyethylene terephthalate at 120°C Vinyl resin forms a weather-resistant barrier layer, and then at 150 ° C, a 300-micron-thick polyolefin film containing 20% by mass fraction of graphene is hot-pressed and laminated on the front of polyethylene terephthalate to form a high thermal conductivity layer. The ethylene vinyl acetate copolymer film with a thickness of 100 microns is hot-compressed and laminated on the surface of the polyolefin film at 110°C, cured at 60°C for 24 hours after winding, and an...
Embodiment 3
[0025] Coating a thermally conductive polyurethane adhesive (containing 30% by mass fraction of alumina) on both sides of a polyethylene terephthalate substrate with a thickness of 188 microns to form a first thermally conductive adhesive layer with a thickness of 10 microns and the second thermally conductive adhesive layer, bake and cure the adhesive at 80-90°C for 10 minutes, and then heat-compress polyvinyl fluoride with a thickness of 28 microns on the back of polyethylene terephthalate at 120°C The resin forms a weather-resistant barrier layer, and then a 300-micron-thick ethylene-vinyl acetate copolymer film containing 20% by mass fraction of aluminum nitride and 30% of graphene is hot-compressed and laminated on polyethylene terephthalate at 130°C. A high thermal conductivity layer is formed on the front side, and then a polyvinyl butyral film with a thickness of 100 microns is hot-compressed on the surface of the high thermal conductivity layer at 110°C. After windin...
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Abstract
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