Nano modified phenolic aldehyde foam insulation board and preparation method thereof

A phenolic foam and nano-modification technology, which is applied in the field of nano-modified phenolic foam insulation board and its preparation, can solve the problems of low cell closure rate, high thermal conductivity of phenolic foam board, and low compressive strength, so as to promote foam Uniformity, lower thermal conductivity, and overall performance improvement

Active Publication Date: 2014-10-01
锦州市好为尔保温材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the phenolic foam board currently on the market is too brittle and easy to drop powder, and has low elasticity, low compressive strength, and thermal conductivity has not reached the theoretical value.
As a result, its excellent fireproof performance is not effectively combined with other existing performances, which affects the further development of the product, and at the same time brings a lot of inconvenience to transportation and construction, and because of its low cell closed cell rate, the thermal conductivity of the phenolic foam board Defects such as too high

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0030] The preparation method of nano-modified phenolic foam insulation board comprises the following steps: carrying out phenolic resin, reactive polyamide resin, liquid nitrile rubber, modified surfactant, toughness modifier, foaming agent and fumed silica Raw material preparation; add curing agent and catalyst to the raw materials in step 1) while stirring them evenly to make them fully and evenly mixed; place the foaming mixture in step 2) on the continuous production line of the board, and keep the temperature at 40°C-50°C , Foaming and curing are complete within 20 minutes, foaming, the mixture is cross-linked, foamed and cured after mixing to form a thermosetting rigid phenolic resin foam board.

[0031] The nano-modified phenolic foam insulation board produced according to the above formula method has the following advantages:

[0032] Thermal conductivity (W / m.K): 0.026;

[0033] pH value: 6.2;

[0034] Compressive strength (MPa) 0.15.

Embodiment 1

[0036] First, raw material preparation of phenolic resin, reactive polyamide resin, liquid nitrile rubber, modified surfactant, toughness modifier, foaming agent and fumed silica. The specific proportions are as follows: 50 parts of phenolic resin, 20 parts of reactive polyamide resin, 5 parts of liquid nitrile rubber, 4 parts of modified surfactant, 9 parts of toughness modifier, 4 parts of foaming agent, gas phase two 2 parts of silicon oxide, while uniformly stirring the above raw materials, add 6 parts of hydrochloric acid as a curing agent and 1 part of hexavaleraldehyde as a catalyst to make it fully and uniformly mixed; then the foaming mixture is placed on the continuous production line of the board to keep the temperature at At 40°C-50°C, the foaming mixture will cross-link, foam and solidify within 20 minutes to form thermosetting hard phenol.

Embodiment 2

[0038] First, raw material preparation of phenolic resin, reactive polyamide resin, liquid nitrile rubber, modified surfactant, toughness modifier, foaming agent and fumed silica. The specific proportions are as follows: 65 parts of phenolic resin, 25 parts of reactive polyamide resin, 15 parts of liquid nitrile rubber, 8.5 parts of modified surfactant, 18 parts of toughness modifier, 10 parts of foaming agent, gas phase dioxide 8 parts of silicon, while stirring the above raw materials, add 8 parts of hydrochloric acid as a curing agent and 5.5 parts of hexavaleraldehyde as a catalyst to make it fully and evenly mixed; then the foaming mixture is placed on the continuous production line of the board to keep the temperature at 40 ℃-50℃ until the foamed mixture is cross-linked, foamed and cured after mixing to form thermosetting hard phenol.

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PUM

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Abstract

The invention relates to a nano modified phenolic aldehyde foam insulation board and a preparation method thereof. The nano modified phenolic aldehyde foam insulation board comprises the following raw materials: 50-65 parts of phenolic resin, 20-25 parts of reactivity polyamide resin, 2-8 parts of fumed silica, 5-15 parts of liquid acrylonitrile-butadiene rubber, 4-8.5 parts of a modified surface-active agent, 9-18 parts of a toughness modifying agent, 4-10 parts of a foaming agent, 6-8 parts of a solidifying agent, and 1-5.5 parts of a catalyst promoter. The preparation method for the nano modified phenolic aldehyde foam insulation board comprises the following steps: firstly, raw materials are prepared; the raw materials are uniformly stirred; meanwhile, the solidifying agents and the catalyst promoters are added, so that the raw materials can be uniformly mixed; foaming mixture is placed on a sheet continuous production line and the temperature is kept to be 40-50 DEC G; after the foaming mixture is mixed, the foaming mixture is cross linked, expands foams and is solidified; the thermosetting phenolic resin rigid foam board is formed. According to the invention, properties of the phenolic aldehyde foam insulation boards prepared according to the technical scheme provided by the invention are improved, particularly the fire-resistant property is improved.

Description

technical field [0001] The invention relates to a nano-modified phenolic foam insulation board and a preparation method thereof, and is especially suitable for outer walls of building enclosure structures. Background technique [0002] Since the early 1990s in my country, the research and development of phenolic foam technology has been rapid. Phenolic foam board is an organic thermosetting rigid foam insulation material, which has the characteristics of low bulk density, low thermal conductivity, good fire performance and convenient construction of organic insulation materials. Especially in recent years, with the gradual improvement of my country's building energy saving rate and fire protection level, the unique properties of phenolic foam such as outstanding fire resistance, flame penetration resistance, low smoke, low toxicity and high temperature resistance have shown advantages, and are more suitable for energy-saving building insulation systems. Require. [0003] Howe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/06C08L77/00C08L9/02C08L71/08C08K3/36C08J3/24C08J9/04
Inventor 李明亮李明树
Owner 锦州市好为尔保温材料有限公司
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