Ultrasonic suspension conveying device

A transmission device, ultrasonic technology, used in transportation and packaging, conveyors, conveyor objects, etc., can solve the problems of pollution, mechanical damage particles of transmission objects, etc., to achieve wide application prospects, high energy utilization and electromechanical conversion efficiency, Resolve the effect of deformation

Inactive Publication Date: 2014-10-08
EAST CHINA UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0010] The purpose of the present invention is to overcome the shortcomings of the above-mentioned prior art, and provide a method that solves the problems of mechanical damage to the transmission object and particle pollution to the environment caused by the traditional contact tran

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  • Ultrasonic suspension conveying device
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Example Embodiment

[0040] In order to be able to describe the technical content of the present invention more clearly, further description will be given below in conjunction with specific embodiments.

[0041] The ultrasonic suspension transmission device proposed by the present invention is connected with two prestressed stacked ultrasonic transducers by a transmission track. By applying a harmonic voltage to the electrodes of a stacked ultrasonic transducer, the inverse piezoelectric effect of the piezoelectric material is used to generate mechanical vibration, and the energy gathering effect of the horn is used to gather energy. The vibration energy is transmitted through the horn and the transmission track. The connection part makes the transmission track produce the same simple harmonic vibration. The vibration of the transmission track causes the interaction between the transmission track and the squeeze film to generate upward levitation force to suspend the object to be transmitted; the stac...

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Abstract

The invention relates to an ultrasonic suspension conveying device. The ultrasonic suspension conveying device comprises a sending end ultrasonic transducer, a receiving end ultrasonic transducer, a conveying rail, a first support, a second support and a fixed rail. The two ends of the conveying rail are connected with the sending end ultrasonic transducer and the receiving end ultrasonic transducer respectively, the two ends of the fixed rail are connected with the first support and the second support respectively, the first support is connected with the sending end ultrasonic transducer, and the second support is connected with the receiving end ultrasonic transducer. By the adoption of the ultrasonic suspension conveying device, the multiple problems of deformation, surface scratches, particle contamination and silicon wafer accuracy reduction caused by mechanical conveying to silicon wafers in photovoltaic industry manufacture are effectively solved, objects with the large size and the small thickness are stably conveyed in a suspension mode without being limited by the characteristics of conveyed materials, the high energy utilization rate and high electro-mechanical transformation efficiency are achieved, and the ultrasonic suspension conveying device is simple, easy to operate, accurate and stable in conveying positioning and wide in application range.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to the field of transmission and assembly in semiconductor manufacturing and micro-electromechanical system (MEMS) manufacturing process, and specifically refers to an ultrasonic levitation transmission device. Background technique [0002] In recent years, with the increasingly serious problems of energy shortage and environmental pollution, the development of clean energy has attracted great attention. Among them, solar cells have promoted the vigorous development of the global photovoltaic industry due to their clean, environmentally friendly and renewable characteristics. The preparation of solar-grade polysilicon wafers is a key link in the photovoltaic industry chain. The development trend of chip thinning, high efficiency, high reliability and cost reduction has greatly promoted the overall progress of key technologies and equipment in the silicon chip manufacturing process. hi...

Claims

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Application Information

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IPC IPC(8): B65G54/00B65G49/07
Inventor 李锦张亭刘长军章文俊
Owner EAST CHINA UNIV OF SCI & TECH
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