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Flame-retardant heat-conducting double-component epoxy resin pouring sealant and preparation method thereof

A technology of epoxy resin and potting glue, applied in the direction of epoxy resin glue, adhesive, polymer adhesive additive, etc., can solve the problems of high linear thermal expansion coefficient, poor mechanical properties, low thermal conductivity, etc. Good, excellent electrical properties, low thermal expansion coefficient

Inactive Publication Date: 2014-11-19
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Most flame retardant epoxy resin potting compounds have disadvantages such as filler settlement, high linear thermal expansion coefficient, poor mechanical properties, and low thermal conductivity.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] (1) Component A: Weigh 30g of bisphenol A epoxy resin 828EL (Shell), 10g of toughening agent carboxyl-terminated butyl rubber, diluent C 12-14 Alkyl glycidyl ether ED-502S (ADEKA Japan) 1g, coupling agent KH-560 0.1g, dispersant BYK-9076 0.01g, defoamer BYK-A530 0.5g, anti-settling agent BYK-410 0.7g, black Put 1g of color paste (Poly one) into the reaction kettle, stir and mix at a stirring speed of 90-150rpm / min; then weigh 55 g of the first filler activated aluminum hydroxide (Foshan Huaya, particle size 20 um) and The second filler spherical alumina (Foshan Huaya, particle size 5 um) 5 g, add in three times, stir in vacuum for 0.5-1h, stop stirring, and obtain component A;

[0030] (2) Component B: Weigh 50g of curing agent methyltetrahydrophthalic anhydride B-570 (Dainippon Ink), 1.2g of curing accelerator K-54 (Air Chemicals), 0.5g of dispersant BYK-9076, anti-settling Put 0.5g of BYK-410 into the reaction kettle, stir and mix at a stirring speed of 90rpm / min; th...

Embodiment 2

[0034] (1) Component A: Weigh 20g of bisphenol F-type epoxy resin 830lvp (Dainippon Ink), 1g of toughening agent hydroxyl-terminated nitrile rubber, 10g of diluent glycidyl tert-carbonate N10 (US HEXION), and couple Additive KH-560 0.5g, dispersant BYK-9076 1g, defoamer BYK-A530 1g, anti-settling agent Deqian 202P 0.4g, black color paste (Poly one) 1.9g, put into the reaction kettle, and the stirring speed is Stir and mix at 90-150rpm / min; then weigh 60 g of the first filler activated aluminum hydroxide (Foshan Huaya, particle size 30 um) and the second filler spherical alumina (Foshan Huaya, particle size 4 um) 6 g, add in three times, stir in vacuum for 0.5-1h, stop stirring, and get A component;

[0035] (2) Component B: Weigh 30g of curing agent methyl hexahydrophthalic anhydride MH-700 (New Nippon Chemical), 5g of curing accelerator 2-ethyl-4-methylimidazole 2E4MZ (Shikoku Kasei), dispersant BYK -9010 0.9g, anti-sedimentation agent Deqian 202P 0.9g, put into the reaction...

Embodiment 3

[0039] (1) Component A: Weigh 40g of bisphenol A epoxy resin JF-9955A (Suzhou Jufeng), 5g of toughening agent hydroxyl-terminated nitrile rubber, diluent C 12-14 Alkyl glycidyl ether ED-502S (ADEKA Japan) 4g, coupling agent KH-560 5g, dispersant BYK-9077 0.5g, defoamer BYK-A550 0.01g, anti-settling agent BYK-410 0.7g, black color Paste (Poly one) 1.7g, put into the reaction kettle, stir and mix at the stirring speed of 90-150rpm / min; then add the first filler active magnesium hydroxide (Foshan Huaya, particle size is 50 um) 60g and the second Two-filler spherical silica powder (Foshan Huaya, particle size 2 um) 3 g, add in three times, stir in vacuum for 0.5-1h, stop stirring, and get A component;

[0040] (2) Component B: Weigh 42g of curing agent methyltetrahydrophthalic anhydride AMT-120 (Zhejiang Alpha Chemical), 1g of curing accelerator BDMA (Shanghai Xindian Chemical), 0.3g of dispersant BYK-9077, and anti-settling agent BYK -430 0.7g, put into the reaction kettle, stir...

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Abstract

The invention relates to a flame-retardant heat-conducting double-component epoxy resin pouring sealant and a preparation method thereof. The pouring sealant is composed of a component A and a component B in a weight ratio of 100: 80 to 100: 120. The pouring sealant prepared in the invention has the advantages of a long operation period, a low thermal expansion coefficient after curing, a high flame retardation grade, reaching grade UL94-V0, good thermal conductivity and excellent electrical properties, and is applicable to high temperature electric packaging of power semiconductors, rectifiers, transformers, etc.

Description

technical field [0001] The invention relates to a flame-retardant and heat-conducting two-component epoxy resin potting glue and a preparation method thereof, belonging to the field of adhesives. Background technique [0002] With the development of the electronics industry, the performance requirements for electronic components and their assembly parts are becoming more and more stringent. Epoxy resin has good physical and mechanical properties after curing, excellent bonding strength to the surface of metal and non-metal materials, good dielectric properties, low shrinkage, good dimensional stability and high hardness. The potting glue with epoxy resin as the main component can effectively improve the protection of electrical components against external shock and vibration, maintain the insulation performance of electrical components, improve the dust-proof and moisture-proof performance of electrical components, and at the same time, the price is low. As the curing agent...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J163/02C09J11/08C09J11/06C09J11/04C08G59/46
Inventor 薛兴旺王建斌陈田安牛青山
Owner YANTAI DARBOND TECH
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