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Conductive heat-conducting composite material and application thereof

A composite material, electric conduction and heat conduction technology, applied in the direction of printed circuit components, etc., can solve problems that do not involve the core technology field of the chip, and achieve the effect of improving electrical performance and reliability, high efficiency, and improving heat conduction and grounding performance

Inactive Publication Date: 2014-12-03
上海柯金电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The products and solutions currently on the market can only deal with the thermal and electrical conduction issues from the metal base to the peripheral non-critical points of the heat sink, and do not involve the core technical field on the chip side

Method used

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  • Conductive heat-conducting composite material and application thereof
  • Conductive heat-conducting composite material and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] 400 parts of highly dispersed conductive silver powder;

[0038] High conductivity copper metal 700 parts;

[0039] 150 parts of polysiloxane resin;

[0040] 20 parts of acid anhydride curing agent;

[0041] 15 parts of methylimidazole.

[0042] Coating and curing the formed conductive and heat-conducting composite material and the surface of the metal flange at the bottom of the chip;

[0043] The coating and curing method is as follows: put each component into a high-speed mixer for mixing, the mixing temperature is 30-150°C, and the mixing time is 3-30 minutes; then, put the mixture into a twin-screw extruder for extrusion, coating on The part where the chip needs to be combined.

[0044] Then implant the chip together with the solder paste / tin sheet into the metal heat sink groove of the PCB, and apply a certain pressure on the top of the chip at the same time;

[0045] Carry out SMT process, the standard is IPC DRM-SMT-1999 (surface mount solder joint evaluati...

Embodiment 2

[0047] 300 parts of highly dispersed conductive silver powder;

[0048] High conductivity copper metal 600 parts;

[0049] 250 parts of polysiloxane resin;

[0050] 35 parts of acid anhydride curing agent;

[0051] 20 parts of methylimidazole.

[0052] Coating and curing the formed conductive and heat-conducting composite material and the surface of the input and output terminals on the side of the chip, the coating and curing method is as in Example 1;

[0053] Then implant the chip together with the solder paste / tin sheet on the chip input and output metal terminals of the PCB, and apply a certain pressure on the top of the chip at the same time;

[0054] Carry out SMT process, the standard is IPC DRM-SMT-1999 (surface mount solder joint evaluation).

Embodiment 3

[0056] 400 parts of highly dispersed conductive silver powder;

[0057] High conductivity copper metal 6700 parts;

[0058] 180 parts of polysiloxane resin;

[0059] 28 parts of acid anhydride curing agent;

[0060] 14 parts of methylimidazole.

[0061] Coating and curing the formed conductive and heat-conducting composite material and the metal heat dissipation base, the coating and curing method is as in Example 1;

[0062] Then the heat sink base, together with the solder paste / tin sheet, is aligned with the heat sink of the system, and a certain pressure is applied on the top of the chip at the same time;

[0063] Carry out SMT process, the standard is IPC DRM-SMT-1999 (surface mount solder joint evaluation).

[0064]The composite material of the present application can be applied to electronic technology fields such as 4G communication base station equipment, microwave broadcasting communication system, smart phone, aerospace, etc., and can meet the signal sensitivity...

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Abstract

The invention relates to a conductive heat-conducting composite material and application thereof. The composite material is prepared from the following components in parts by weight: 200-600 parts of high-dispersion conductive sliver powder, 400-800 parts of high-conductivity copper metal, 100-200 parts of organopolysiloxane resin, 10-100 parts of acid anhydride curing agents and 10-50 parts of methylimidazole. The raw materials are mixed at a high speed, extruded and cured to obtain the conductive heat-conducting composite material. The conductive heat-conducting composite material disclosed by the invention has the advantages of good processing formability, outstanding heat-conducting conductive performances, and the like, can be particularly used for greatly solving a problem that a cavity is formed in SMT (surface mount technology) welding after solder paste and solder sheet are compounded and mixed in a PCB (printed circuit board) processing process, so that the ground signaling integrity of a chip and the PCB and the high heat conductivity of the chip and a PCB radiating metal base are greatly improved, thereby improving the stability and the reliability of a circuit system.

Description

technical field [0001] The invention relates to an electronic printed circuit board processing technology, in particular to a conductive and thermally conductive composite material used in the welding of a high-frequency chip, a printed circuit board (PCB) and a metal heat dissipation base. Background technique [0002] With the development of electronic technology, the miniaturization and intensification of products have become a trend. Especially in the fields of communication, microwave, aerospace, smart phones, etc., the operating frequency of the system is gradually increasing, and the processing capability of the chip is gradually improving. How to improve the signal sensitivity, reliability and heat dissipation of the electronic system has become a hot spot. [0003] In order to solve this problem, in the PCB industry, the chip embedded metal base welding technology is generally used to solve the grounding and heat dissipation problems. The current chip welding techn...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08K13/02C08K3/08H05K1/02
Inventor 柳珩
Owner 上海柯金电子科技有限公司