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High-thermal-resisting POSS-based epoxy resin nano composite material for PCBs and preparation method of high-thermal-resisting POSS-based epoxy resin nano composite material

A nano-composite material and epoxy resin-based technology, which is applied in the field of high heat-resistant POSS-based epoxy resin nano-composite materials for PCB and its preparation, can solve the problems of high brittleness, heat resistance and strength to be improved, and achieve low Effects of water absorption, low thermal expansion coefficient, and heat resistance improvement

Active Publication Date: 2014-12-10
东莞上海大学纳米技术研究院 +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, epoxy resins still have many deficiencies, such as greater brittleness due to high cross-linking density, heat resistance and strength to be improved, etc.

Method used

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  • High-thermal-resisting POSS-based epoxy resin nano composite material for PCBs and preparation method of high-thermal-resisting POSS-based epoxy resin nano composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] The high heat-resistant POSS-based epoxy resin nanocomposite material for PCB provided in this embodiment is made of the following components by weight: 50-80 parts of epoxy resin, 20-50 parts of curing agent, functionalized POSS0.1 -10 copies. Wherein, the sum of the parts by mass of the epoxy resin and curing agent is 90-100 parts, preferably 100 parts. The epoxy resin is one or more mixtures of bisphenol F epoxy resin, bisphenol A epoxy resin, bisphenol S epoxy resin and novolac epoxy resin. The curing agent is a mixture of one or more of amines, phenolic resins or acid anhydrides. The functionalized POSS is cage-shaped octaaminophenyl polysilsesquioxane.

[0018] The method for preparing said PCB with high heat-resistant POSS base epoxy resin nanocomposite material, it may further comprise the steps:

[0019] 1) Weigh each component by weight: 50-80 parts of epoxy resin, 20-50 parts of curing agent, 0.1-10 parts of functionalized POSS; the sum of the parts by mas...

Embodiment 2

[0024] The composite material and preparation method provided in this example are basically the same as the aforementioned Example 1, the difference is that: take 60 parts of bisphenol A epoxy resin, 2 parts of cage-type octaaminophenyl POSS, and place them in 250ml three-port Stir in the bottle for 0.5h, add 35 parts of methyl hexahydrophthalic anhydride, and continue stirring for 0.5h to obtain a homogeneous mixture. Add the mixture into a mold coated with a release agent, vacuum defoam at 80°C, then program temperature rise at 120°C / 2h, 150°C / 6h for solidification, and finally cool to room temperature for demoulding to obtain a composite material sample. Do mechanical properties, dielectric properties, thermal conductivity tests.

Embodiment 3

[0026] The composite material and preparation method provided by this embodiment are basically the same as those of the foregoing embodiments 1 and 2, except that: take 57 parts of bisphenol A epoxy resin, 1 part of cage-type octaaminophenyl POSS, place Stir in a 250ml three-neck flask for 0.5h, add 33 parts of methyl hexahydrophthalic anhydride, and continue stirring for 0.5h to obtain a homogeneous mixture. Add the mixture into a mold coated with a release agent, vacuum defoam at 80°C, then program temperature rise at 120°C / 2h, 150°C / 6h for solidification, and finally cool to room temperature for demoulding to obtain a composite material sample. Do mechanical properties, dielectric properties, thermal conductivity tests.

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Abstract

The invention relates to a high-thermal-resisting POSS-based epoxy resin nano composite material for PCBs. The high-thermal-resisting POSS-based epoxy resin nano composite material is characterized by being prepared from the following components in parts by weight: 50-80 parts of epoxy resin, 20-50 parts of a curing agent and 0.1-10 parts of functional POSS. The invention further discloses a method for preparing the high-thermal-resisting POSS-based epoxy resin nano composite material for PCBs. According to the high-thermal-resisting POSS-based epoxy resin nano composite material for PCBs, the vitrification temperature of condensate of the composite material is increased by 5-60 DEG C, the thermal resistance is remarkably improved, and the bending strength, the impact resistance, the dielectric property and the thermal conductivity are greatly improved when being compared with those of pure epoxy resin. The composite material system disclosed by the invention is relatively high in vitrification transition temperature, low in water absorption, relatively low in dielectric constant and dielectric loss, low in dilatation coefficient, high in thermal reliability and high in thermal conductivity and mechanical property after being cured, and is good in machining property.

Description

technical field [0001] The invention relates to a high heat-resistant material for PCB, in particular to a high heat-resistant POSS-based epoxy resin nanocomposite material for PCB and a preparation method thereof. Background technique [0002] Epoxy resin is one of the important thermosetting materials. Because of its excellent thermal stability, mechanical properties and easy processability, it is widely used in the fields of adhesives, electronic packaging materials, coatings and aerospace, especially in PCB boards. However, epoxy resins still have many deficiencies, such as greater brittleness due to high cross-linking density, heat resistance and strength to be improved and so on. The cost of synthesizing a new type of high-performance epoxy resin is very high, and adding modifiers to the original epoxy resin matrix through grafting, copolymerization, and blending can save costs and improve certain epoxy resin properties. properties and is therefore a commonly used me...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K5/549
Inventor 付继芳陈立亚施利毅宗培松殷金涛余文琪黄雷柴颂刚杜翠鸣苏晓声
Owner 东莞上海大学纳米技术研究院