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Double-hemisphere-structured miniature resonant gyroscope and manufacturing method thereof

A technology of resonant gyroscope and hemispherical resonator, which is applied in the field of dual-hemispherical micro-resonant gyroscope and its preparation, can solve the problem of not being able to simultaneously realize high bandwidth, high resolution, high sensitivity, high dynamic range, limiting the application range of gyroscopes, integrating / differential error and other issues, to achieve high bandwidth, high resolution, and improve the effect of measurement accuracy

Active Publication Date: 2014-12-10
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the currently visible micro-hemispherical resonant gyroscope can only detect one of the external input angular velocity or angle at the same time in a single device, and the other item needs to be calculated through the integral / differential link, which will introduce integral / differential errors. Reduced measurement accuracy
However, a single device cannot achieve performance indicators such as high bandwidth, high resolution, high sensitivity, and high dynamic range at the same time, which greatly limits the application range of gyroscopes.

Method used

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  • Double-hemisphere-structured miniature resonant gyroscope and manufacturing method thereof
  • Double-hemisphere-structured miniature resonant gyroscope and manufacturing method thereof
  • Double-hemisphere-structured miniature resonant gyroscope and manufacturing method thereof

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Embodiment 1

[0036] like figure 2 As shown, the present embodiment provides a dual hemispherical micro-resonant gyroscope, including:

[0037] a single crystal silicon substrate 1;

[0038] Sixteen evenly distributed electrodes 2;

[0039] Two symmetrical miniature hemispherical resonators 3;

[0040] A central fixed support column 4;

[0041] Wherein, the upper and lower ends of the central fixed support column 4 are respectively connected with two miniature hemispherical resonators 3, and eight electrodes 2 are evenly distributed around each miniature hemispherical resonator 3; the two miniature hemispherical resonators 3 have the same The central axes are independent of each other and do not affect each other.

[0042] In this embodiment, the material of the base 1 is monocrystalline silicon, which is directly connected to the central fixed support column 4;

[0043] In this embodiment, the material 2 of the electrodes is boron ion-doped silicon, eight of the electrodes 2 are even...

Embodiment 2

[0048] This embodiment provides a method for preparing the micro-resonant gyroscope with a dual-hemispherical structure, including the following steps:

[0049] The first step, as shown in Figure 1(a), cleans the single crystal silicon substrate 1, Glue coating, photolithography, development, boron ion implantation, and glue removal processes are performed on the front side of the substrate to obtain an electrode 2 of boron ion-doped silicon material with a depth of 10 μm-50 μm on the single crystal silicon substrate 1;

[0050] In the second step, as shown in Figure 1(b), glue coating, photolithography, development, isotropic etching, and glue removal are carried out on the basis of the first step, and a radius of 300- 700μm hemispherical deep groove;

[0051] The third step, as shown in Figure 1(c), is to apply glue on the front side for protection and prepare the reverse side process;

[0052] The fourth step, as shown in Figure 1(d), repeats the first and second steps on...

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Abstract

The invention provides a double-hemisphere-structured miniature resonant gyroscope and a manufacturing method thereof. The gyroscope comprises a monocrystalline silicon base, sixteen uniformly-distributed electrodes, two symmetrical miniature hemispherical resonators and a center-fixed supporting column, wherein the upper and lower ends of the center-fixed supporting column are respectively connected with the two miniature hemispherical resonators, and eight electrodes are uniformly distributed around each miniature hemispherical resonator; the two miniature hemispherical resonators have the same central shaft, are independent of each other and do not affect each other. The two miniature hemispherical resonators are respectively excited to work by adopting an electrostatic driven manner, and a drive mode and a detection mode are respectively matched with each other. The gyroscope is manufactured by combining an MEMS (Micro-Electromechanical Systems) bulk silicon processing process and a surface silicon processing process. According to the double-hemisphere-structured miniature resonant gyroscope and the manufacturing method thereof, influence caused by factors, such as centrifugal force, centripetal force, common-mode noise, quadratic nonlinear terms and the like is reduced in a differential processing manner; performance indexes, such as high bandwidth, high resolution, high sensitivity, high dynamic range and the like, are simultaneously achieved on a single device.

Description

technical field [0001] The invention relates to a micro-resonant gyroscope in the field of micro-electromechanical technology, in particular to a micro-resonant gyroscope with a dual-hemisphere structure and a preparation method thereof. Background technique [0002] Gyroscope is an inertial device that can detect the angle or angular velocity of the carrier, and it plays a very important role in the fields of attitude control, navigation and positioning. With the development of national defense technology and aviation and aerospace industries, the requirements of inertial navigation systems for gyroscopes are also developing in the direction of low cost, small size, high precision, multi-axis detection, high reliability, and adaptability to various harsh environments. Therefore, the importance of MEMS gyroscope is self-evident. In particular, as an important research direction of MEMS gyroscopes, micro-resonant gyroscopes have become a research hotspot in this field. [0...

Claims

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Application Information

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IPC IPC(8): G01C19/56G01C25/00B81C1/00
CPCB81C1/00388B81C1/00539B81C1/00595B81C1/00849G01C19/56G01C25/00
Inventor 张卫平唐健汪濙海刘亚东成宇翔孙殿竣邢亚亮陈文元
Owner SHANGHAI JIAO TONG UNIV
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