Single-packaging organic silicon gel packaging adhesive for high-power white light LEDs (light-emitting diodes) and preparation method thereof

Abstract

The invention discloses a single-packaging organic silicon gel packaging adhesive for high-power white light LEDs (light-emitting diodes) and a preparation method thereof. The single-packaging organic silicon gel packaging adhesive for high-power white light LEDs is prepared from the following raw materials in parts by weight: 100-120 parts of self-crosslinked phenyl organic silicon resin with 30-40% of phenyl group, 0.001-0.005 part of catalyst, 0.002-0.005 part of inhibitor and 1-10 parts of tackifying agent. The preparation method comprises the following steps: adding the catalyst, inhibitor and tackifying agent into the self-crosslinked phenyl organic silicon resin with 30-40% of phenyl group, stirring uniformly, and carrying out vacuum degassing for 15-30 minutes to obtain the high-transparency high-refractivity single-packaging organic silicon gel packaging adhesive for high-power white light LEDs. The preparation method has the characteristics of simple preparation process and the like, and is convenient to operate and suitable for industrial production.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a single-package organic silicon gel encapsulant for high-power white light LEDs and a preparation method. Background technique [0002] With the rapid development of LED packaging, electronic packaging and other industries, the development of packaging materials that are resistant to thermal shock, non-yellowing, high light transmittance, and high refractive index is an important key technology that urgently needs to be solved in the manufacture of power-type white light LEDs. At present, ordinary LED packaging materials are mainly bisphenol A transparent epoxy resin, which is the most widely used because of its low price, but due to the poor heat resistance, moisture resistance, and softness of epoxy resin, it is easy to turn yellow, brittle, and has low impact strength. , It is easy to produce stress cracking, shrinkage of cured products, etc., and intern...

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Problems solved by technology

The main problems in this preparation are: on the one hand, when the refraction difference between the vinyl phenyl silicone resin and the crosslinking agent increases, the molecular structure of the two will differ greatly, so the compatibility will become poor. The light transmittance of the gel is poor; on the other hand, it is difficult to achieve uniform mixing and full curing when mixing and curing the two, resulting in a decrease in the performance of the LED encapsulant; it is difficult to meet the development needs of the high-power LED encapsulation industry