Flexible conductive adhesive capable of being used in direct coating manner and preparation method of flexible conductive adhesive

A flexible conductive and coating technology, which is applied in the direction of conductive adhesives, adhesives, epoxy resin glue, etc., can solve the problems that cannot meet the needs of flexible conductive connections, reduce the conductive performance, and easily destroy the conductive path, and achieve the goal of overcoming Easy to crack, excellent electrical conductivity, good flexibility effect

Inactive Publication Date: 2015-01-07
TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, during the bending and curling process of this kind of conductive adhesive filled with flake silver powder, the original conductive path is easily destroyed, which greatly reduces its conductive performance.
Therefore, it cannot meet the needs of flexible electronic products for flexible conductive connections

Method used

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  • Flexible conductive adhesive capable of being used in direct coating manner and preparation method of flexible conductive adhesive
  • Flexible conductive adhesive capable of being used in direct coating manner and preparation method of flexible conductive adhesive
  • Flexible conductive adhesive capable of being used in direct coating manner and preparation method of flexible conductive adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] 1) First weigh the following components:

[0037]

[0038] 2) Fully mix TKM-828, DER732, methylhexahydrophthalic anhydride, 2-ethyl-4-methylimidazole, and KH560 weighed in 1) to obtain a matrix;

[0039] 3) Add the ethanol solution of silver nanowires to the matrix of 2), mix well, and vacuumize for 24 hours to remove ethanol; then add the flake silver powder SF-0340 weighed in 1), mix well, Get a flexible conductive adhesive for direct coating use.

[0040] The silver nanowire ethanol solution used in this embodiment has a length of 15-60 μm, a diameter of 150-350 nm, and a concentration of 0.05 g / ml.

[0041] The flexible conductive adhesive of this embodiment is cured for 2 hours at 150°C, and the resistivity is 6.65×10 -5 Ω·cm, excellent electrical conductivity; and, if figure 1 As shown, the bending resistance of the flexible conductive adhesive is much better than that of the conductive adhesive prepared with ordinary epoxy as the matrix and flake silver pow...

Embodiment 2

[0043] 1) First weigh the following components:

[0044]

[0045] 2) Fully mix the TKM-828, DER732, methyltetrahydrophthalic anhydride, Ni-imidazole complex, and KH550 weighed in 1) to obtain a matrix;

[0046] 3) Add the ethanol solution of copper nanowires to the matrix of 2), mix well, and vacuumize for 24 hours to remove ethanol; then add the flake silver powder SF-0340 weighed in 1), mix well, Get a flexible conductive adhesive for direct coating use.

[0047] The ethanol solution of copper nanowires used in this embodiment has a length of 0.8-6 μm, a diameter of 100-200 nm, and a concentration of 0.2 g / ml.

[0048] The flexible conductive adhesive of this embodiment is cured for 2 hours at 150°C, and the resistivity is 8.56×10 -5 Ω·cm, excellent electrical conductivity; and, if figure 1 As shown, the bending resistance of the flexible conductive adhesive is much better than that of the conductive adhesive prepared with ordinary epoxy as the matrix and flake silver ...

Embodiment 3

[0050] 1) First weigh the following components:

[0051]

[0052] 2) TKM-828, DER732, methyl hexahydrophthalic anhydride, methyl tetrahydrophthalic anhydride, 2-ethyl-4-methylimidazole, 2-ethyl Mix imidazole and KH570 thoroughly to obtain a matrix;

[0053] 3) Add the ethanol solution of gold nanowires to the matrix of 2), mix well, and vacuumize for 24 hours to remove ethanol; then add the flaky silver powder SF-0340 weighed in 1), mix well, Get a flexible conductive adhesive for direct coating use.

[0054] The ethanol solution of gold nanowires used in this embodiment has a length of 3-6 μm, a diameter of 20-50 nm, and a concentration of 0.1 g / ml.

[0055] The flexible conductive adhesive of this embodiment is cured for 2 hours at 150°C, and the resistivity is 7.83×10 -5 Ω·cm, excellent electrical conductivity; and, if figure 2 As shown, the bending resistance of the flexible conductive adhesive is much better than that of the conductive adhesive prepared with ordin...

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Abstract

The invention discloses a flexible conductive adhesive capable of being used in a direct coating manner and a preparation method. The flexible conductive adhesive consists of 15-20wt% of flexible epoxy, 3-8wt% of a curing agent, 0.1-0.5wt% of an accelerant, 0.1-0.5wt% of a coupling agent, 65-80wt% of silver powder and 0.2-10wt% of flexible one-dimensional nano conductive material, wherein the flexible epoxy is a mixture of bisphenol-A epoxy resin with ethylene-vinyl acetate copolymer soft segments grafted and aliphatic glycidyl ether epoxy resin; the curing agent is one or more of methylhexahydrophthalic anhydride, methyl tetrahydrophthalic anhydride and tetrahydrophthalic anhydride; the accelerant is an imidazole compound; the coupling agent is one or more of KH 550, KH560 and KH570; the flexible one-dimensional nano conductive material is a carbon nano tube or a conductive metal nano wire. The flexible conductive adhesive has the excellent conductivity and the good flexibility, the conductivity is almost not changed after being bent repeatedly, and the flexible conductive adhesive can meet requirements of flexible electronic products.

Description

technical field [0001] The invention belongs to the technical field of microelectronic packaging materials and preparation, and in particular relates to a flexible conductive adhesive for direct coating and a preparation method thereof. Background technique [0002] As an alternative product of traditional Sn / Pb solder, conductive adhesive has the advantages of low bonding temperature, high density, narrow pitch connection ability, good environmental performance, can be connected with different substrates, simple bonding equipment and low cost, etc. Therefore, it has been widely used. [0003] Generally speaking, conductive adhesive is composed of matrix and filler. The matrix is ​​mainly epoxy resin. Epoxy resin has good physical and chemical properties. It has excellent bonding strength to the surface of metal and non-metal materials, good dielectric properties, good dimensional stability of products, high hardness, and stability to alkali and most solvents. In addition...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J151/08C09J9/02
Inventor 付绍云纪艳红刘玉
Owner TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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