Environment-friendly high-heat-stability LED (light-emitting diode) photosensitive packaging adhesive and preparation method thereof

A packaging glue and thermal stability technology, applied in chemical instruments and methods, adhesives, other chemical processes, etc., can solve the problems of high thermal expansion rate, weak environmental protection performance, poor thermal stability, etc., achieve high light transmittance, satisfy curing The effect of time requirements

Active Publication Date: 2015-01-07
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these encapsulants have disadvantages such as poor thermal stability, low tear strength or weak environmental performance.
A one-component silica gel produced by Japan's Shin-Etsu, which has good adhesion and flexibility, but due to the addition of white carbon black and other powders to the glue, the light transmittance is very poor (light transmittance is lower than 90%)
Maneesh of Dow Corning in the United States uses branched vinyl phenyl silicone resin mixed with vinyl silicone oil and hydrogen-containing silicone oil to cure. Its light transmittance is good, but this type of silicone material has low mechanical strength and high thermal expansion rate.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0023] The final cured product of the LED photosensitive encapsulant made by the preparation process of the present invention is a PPF / PPF-DA cross-linked cured body, i.e. polytrimethylene fumarate / polytrimethylene fumarate co-diacrylate cross-linked cured body. By adjusting the light intensity and the distance between the light source and the sample, the curing time of PPF and PPF-DA can be controlled in a short time to meet the curing time requirements of LED photosensitive packaging adhesives. Different ratios of PPF / PPF-DA were prepared, and the physical properties of the cross-linked cured body as LED photosensitive packaging adhesive were tested. The results show that the cross-linked cured products with different double bond ratios have higher light transmittance and thermal stability, and the mechanical properties increase with the decrease of the double bond ratio. The specific instructions are as follows:

[0024] Preparation of component A: Weigh a certain amount ...

example 1

[0027] Example 1: ① Weigh 2.00g of component A (PPF) and 1.04g of component B (PPF-DA) respectively, the double bond ratio of component A to component B is 2:1, if the viscosity of PPF and PPF-DA Larger, inconvenient to measure, first adjust the temperature to 30°C in a vacuum drying oven and heat for 5 minutes to reduce the viscosity, which is convenient to measure, and use the same Erlenmeyer flask when measuring. The weighed components A and B were dissolved in 20 mL of dry dichloromethane and mixed to obtain a mixed solution. ②Stir the mixed solution with a magnetic stirrer and continue stirring for 0.5h. After stirring, remove the magnet. The mixed solution was rotary evaporated under vacuum conditions (-0.06MPa), the temperature was set at 37°C, and the rotary evaporation continued for 1h. ③Seal the mouth of the Erlenmeyer flask containing the mixture after rotary evaporation with coarse filter paper to prevent volatilization of the mixture, put it in a vacuum drying o...

example 2

[0029] Example 2: ① Weigh 2.00g component A (PPF) and 2.08g component B (PPF-DA) respectively, the double bond ratio of component A and component B is 1:1, if the viscosity of PPF and PPF-DA Larger, inconvenient to measure, first adjust the temperature to 30°C in a vacuum drying oven and heat for 5 minutes to reduce the viscosity, which is convenient to measure, and use the same Erlenmeyer flask when measuring. The weighed components A and B were dissolved in 20 mL of dry dichloromethane and mixed to obtain a mixed solution. ②Stir the mixed solution with a magnetic stirrer and continue stirring for 0.5h. After stirring, remove the magnet. The mixed solution was rotary evaporated under vacuum conditions (-0.06MPa), the temperature was set at 37°C, and the rotary evaporation continued for 1h. ③Seal the mouth of the Erlenmeyer flask containing the mixture after rotary evaporation with coarse filter paper to prevent volatilization of the mixture, put it in a vacuum drying oven, ...

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PUM

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Abstract

The invention provides an environment-friendly high-heat-stability LED (light-emitting diode) photosensitive packaging adhesive and a preparation method thereof. The end curing product of the packaging adhesive is a PPF / PPF-DA crosslinked curing body, namely propylene glycol polyfumarate / propylene glycol polyfumarate-diacrylate crosslinked curing body. The curing product has no toxicity; the intensity of illumination and the distance between the light source and sample are regulated to control the curing time within a short time, thereby greatly satisfying the requirement of LED packaging for curing time; and the packaging adhesive curing product has the advantages of higher light transmittance, higher heat stability and higher mechanical properties.

Description

technical field [0001] The invention relates to an LED photosensitive packaging glue based on polytrimethylene fumarate, in particular to an environmentally friendly thermally stable LED photosensitive packaging glue and a preparation method thereof. Background technique [0002] Compared with traditional light sources, LED solid-state light-emitting devices have the advantages of low working voltage, high luminous efficiency, long life, good monochromaticity, solid state, and do not contain harmful substances such as mercury and lead. They are recognized as the fourth generation to replace incandescent lamps. light source. [0003] With the rapid development of the electronic information industry, light-curing adhesives have also made great progress. Light-curing adhesives have the advantages of high curing efficiency, low energy consumption, no solvent pollution, and can be cured at room temperature. They have developed rapidly and have been widely used in daily life fiel...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J167/02C09J11/06C09K3/10H01L33/56
Inventor 郭大刚王亮
Owner XI AN JIAOTONG UNIV
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