A test device for thermal molding and curing deformation of resin-based composite materials and the preparation and use method of the device
A composite material, curing deformation technology, applied in the direction of measuring devices, optical devices, special recording/indicating devices, etc., can solve the problems of fragility and breakage of the gate area, inability to effectively transmit monitoring signals, and difficulty in detachment of fully rigid molds, etc., to achieve Conducive to demoulding, avoiding artificial large deformation, and easy to slip
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Embodiment 1
[0041] A test device for hot molding and curing deformation of resin-based composite materials, including resin-based composite material prepregs 5 laid in the mold and FBG sensors arranged in the middle, and multiple FBG sensors are laid in the same prepreg layup or Lay FBG sensors in multiple prepreg layers, lay FBG sensors along the fiber axis direction on the nth layer (n>1) as a strain sensor 6, and lay a reference sensor 7 for temperature compensation on the n+1th layer, The mold side wall frame plate is provided with a lead wire groove 3, and the surface of the mold side wall frame plate and the lead wire groove is covered with a high temperature resistant polymer film 4, and the lead wire of the sensor is drawn out from the lead wire groove 3 of the mold side wall frame plate 1. The signal receiver is switched on.
[0042] Preparation and use method:
[0043] (1) Process lead grooves with a width of 10mm and a depth of 1.5mm at the middle position of each side and at ...
Embodiment 2
[0053] A test device for hot molding and curing deformation of resin-based composite materials, including resin-based composite material prepregs 5 laid in the mold and FBG sensors arranged in the middle, and multiple FBG sensors are laid in the same prepreg layup or FBG sensors are respectively laid in multiple prepreg layups, FBG sensors are laid on the nth layer (n>1) along the direction of the fiber axis as strain sensors 6, and reference sensors 7 for temperature compensation are also laid on the nth layer. The side wall frame plate is provided with a lead groove 3, and the surface of the mold side wall frame plate and the lead groove is covered with a high temperature resistant polymer film 4, and the lead wire of the sensor is drawn out from the lead groove 3 of the mold side wall frame plate 1 to communicate with the signal. The receiver is switched on.
[0054] Preparation and use method:
[0055] (1) Process lead grooves with a width of 10 mm and a depth of 2.0 mm a...
Embodiment 3
[0065] A test device for hot molding and curing deformation of resin-based composite materials, including resin-based composite material prepregs 5 laid in the mold and FBG sensors arranged in the middle, and multiple FBG sensors are laid in the same prepreg layup or FBG sensors are respectively laid in multiple prepreg layups, FBG sensors are laid along the fiber axis direction on the nth layer (n>1) as strain sensors 6, and reference sensors 7 for temperature compensation are laid on the n-1th layer, The mold side wall frame plate is provided with a lead wire groove 3, and the surface of the mold side wall frame plate and the lead wire groove is covered with a high temperature resistant polymer film 4, and the lead wire of the sensor is drawn out from the lead wire groove 3 of the mold side wall frame plate 1. The signal receiver is switched on.
[0066] Preparation and use method:
[0067] (1) Process lead grooves with a width of 10 mm and a depth of 2.0 mm at the middle p...
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