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Evaporation source, film-forming facility and film-forming method thereof

A technology of film-forming equipment and evaporation source, which is applied in the direction of vacuum evaporation plating, ion implantation plating, metal material coating process, etc., can solve the problems that the evaporation source cannot reach the saturated vapor pressure and the thickness of the film is not uniform, etc. To achieve the effect of short evaporation process time, high production efficiency and uniform film formation

Active Publication Date: 2015-02-04
BOE TECH GRP CO LTD +1
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Problems solved by technology

[0007] The present invention provides an evaporation source, film forming equipment and a film forming method thereof, which are used to solve the problem that in the prior art, with the loss of the film material, the inside of the evaporation source cannot reach the saturated vapor pressure, resulting in the evaporation of the film on the substrate. The problem of uneven layer thickness

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  • Evaporation source, film-forming facility and film-forming method thereof
  • Evaporation source, film-forming facility and film-forming method thereof
  • Evaporation source, film-forming facility and film-forming method thereof

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Embodiment Construction

[0022] For the evaporation film forming process, the evaporation source used in the prior art is a crucible, and the gas outlet of the crucible is the evaporation surface. During the evaporation process, the crucible linearly moves from one side of the substrate to be evaporated to the opposite side to complete the evaporation of the film layer on the entire substrate. However, due to the small capacity of the crucible, with the continuous consumption of evaporation materials, the vapor pressure in the crucible is not easy to control at the same temperature, and the uniformity of film formation is affected by many factors such as difficult control of saturated vapor pressure and uniformity of scanning rate. impact and is less efficient.

[0023] In order to solve the above technical problems, the present invention provides an evaporation source. By setting the evaporation surface of the evaporation source to match the size of the substrate to be evaporated, the generated vapor...

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Abstract

The invention relates to the technical field of organic device preparation, and discloses an evaporation source, a film-forming facility and a film-forming method thereof. Through setting an evaporation surface of the evaporation source to be matched with the size of a substrate to be evaporated, the evaporation surface can not move in the process of evaporation, and the evaporation of a film on the substrate is completed in a time, so that a situation that in the process of evaporation, because steam evaporated on the whole substrate is in a same steam pressure, a formed film is uniform is ensured. Meanwhile, the technical scheme of the invention also has the advantages of short evaporation process time and high production efficiency.

Description

technical field [0001] The invention relates to the technical field of organic device preparation, in particular to an evaporation source for preparing organic thin films, film forming equipment and a film forming method. Background technique [0002] Flat panel displays include Liquid Crystal Display (LCD for short), OLED (Organic Light-Emitting Diode, OLED for short) display, Plasma Display Panel (PDP for short) and electronic ink display. Among them, OLED display has the advantages of light and thin, low power consumption, high contrast, high color gamut, and flexible display, and is the development trend of the next generation of flat panel displays. [0003] OLED displays include active OLEDs and passive OLED displays. Among them, the manufacturing process of active OLED displays includes LTPS (low temperature polysilicon thin film transistor) backplane + fine metal mask (FMM Mask) to form OLED, and Oxide (oxide thin film transistor) backplane + white OLED + color film...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/24C23C14/12C23C14/04
CPCC23C14/04C23C14/12C23C14/24
Inventor 张金中
Owner BOE TECH GRP CO LTD
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