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Method for adopting electron beam to solidify nanometer material

A technology of nanomaterials and electron beams, applied in the direction of nanotechnology, nanotechnology for materials and surface science, nanotechnology, etc., can solve problems such as large environmental pollution, product quality defects, deformation and warping of substrates, and achieve electrical conductivity The effect of increasing the rate, avoiding quality defects, and reducing the surface resistance

Inactive Publication Date: 2015-02-25
CGN DASHENG ELECTRON ACCELERATOR TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In the prior art, high-temperature deposition is generally used to consolidate nanomaterials on the surface of the substrate, but the high-temperature treatment process usually leads to deformation and warping of the substrate, resulting in product quality defects, and many organic solvents are used in the process. more polluted

Method used

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  • Method for adopting electron beam to solidify nanometer material
  • Method for adopting electron beam to solidify nanometer material

Examples

Experimental program
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Effect test

Embodiment 1

[0026] Coat a layer of nano-silver paste coating with a thickness of 2 microns on the PET (polyester) film, dry at low temperature (50-70°C) to volatilize the solvent in the paste, and then perform electron beam irradiation treatment at 150 KGy The electron beam dose is scanned for 1s, and the nano-silver coating is consolidated. Then carry out the above-mentioned performance test, and the test results are shown in Table 1.

Embodiment 2

[0028] Coat a layer of nano-silver paste coating with a thickness of 7 microns on the PET (polyester) film, dry at low temperature (50-70°C) to volatilize the solvent in the paste, and then perform electron beam irradiation treatment at 180 KGy The electron beam dose is scanned for 0.5s, and the nano-nickel coating is consolidated. Then carry out the above-mentioned performance test, and the test results are shown in Table 1.

Embodiment 3

[0030] Coat a layer of nano-silver paste coating with a thickness of 15 microns on the PET (polyester) film, dry at low temperature (50-70°C) to volatilize the solvent in the paste, and then conduct electron beam irradiation treatment at 160 KGy The electron beam dose is scanned for 1s, and the nano-indium tin oxide coating is consolidated. Then carry out the above-mentioned performance test, and the test results are shown in Table 1.

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Abstract

The present invention discloses a method for adopting an electron beam to solidify a nanometer material. According to the present invention, the excellent characteristic of the electron beam is applied in the technical field of nanometer material consolidation, the particle state of the nanometer silver slurry is converted into the complete film state of the continuous phase within an extreme short time, the surface resistance is substantially decreased, and the conductivity is substantially increased; and characteristics of mild processing process conditions, no high temperature, no pollution, low cost, energy saving and environmental protection are provided, the energy of the electron beam is selectively applied for the nanometer material, the substrate deformation caused by the high temperature can not be produced, and the quality defect of the product is avoided.

Description

technical field [0001] The invention relates to a method for using electron beams to consolidate nanomaterials, which belongs to the technical field of nanomaterial processing. Background technique [0002] Nanomaterials refer to materials that have at least one dimension in the nanoscale range (1-100nm) or are composed of them as basic units in three-dimensional space. Their small size also brings excellent performance. When they are applied to electronics Products show better electrical properties, therefore, as a new functional material, nanomaterials have been widely used and researched in the field of electronics. In the prior art, high-temperature deposition is generally used to consolidate nanomaterials on the surface of the substrate, but the high-temperature treatment process usually leads to deformation and warping of the substrate, resulting in product quality defects, and many organic solvents are used in the process. Pollution is relatively large. In view of t...

Claims

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Application Information

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IPC IPC(8): C23C24/08B82Y30/00B82Y40/00
Inventor 罗洪文曹晨雷肖峰
Owner CGN DASHENG ELECTRON ACCELERATOR TECH
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