Laminate for circuit boards, metal-based circuit board, and power module
A technology for circuit substrates and metal substrates, which is applied in the direction of circuit substrate materials, circuits, printed circuits, etc., can solve the problems of increased stress, difficulty in ensuring durability and welding reliability, and achieve excellent durability and excellent welding reliability. Effect
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[0069] Hereinafter, examples of the present invention will be described. The present invention is not limited to these examples.
[0070]
Synthetic example 1
[0071] Synthesis Example 1: Preparation of Composition 1
[0072] Bisphenol A type cyanate resin (Lonza, "BA200") and phenol novolac type cyanate resin (Lonza, "PT30") were heated and mixed at a mass ratio of 3:1, and then calculated according to the amount of the resin. 1% by mass of a phosphorus-based curing accelerator (tetraphenylphosphine tetraborate; manufactured by Hokko Chemical Co., Ltd., "TPP-MK") was mixed. In this mixed resin, dimethylacetamide is added to form a cyanate resin solution with a resin solid content of 40% by mass. For this cyanate resin solution, boron nitride (Mizushima Made of alloy iron, "HP-40") and aluminum nitride ("FAN-f30" manufactured by Furukawa Electronics Co., Ltd.) so that the total volume becomes 65% by volume based on the solid content of the resin, thereby preparing an insulating material solution (composition 1 ).
Synthetic example 2~5
[0073] Synthesis Examples 2-5: Preparation of Compositions 2-5
[0074] The ratio of bisphenol A cyanate resin (manufactured by Lonza, "BA200") and phenol novolac cyanate resin (manufactured by Lonza, "PT30") was changed to the ratio described in Table 3, except that , Compositions 2-5 were prepared in the same preparation method as Composition 1.
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