Processing device and processing method for cutting sapphire glass by utilizing infrared laser

Abstract

The invention relates to a processing device and a processing method for cutting sapphire glass by utilizing infrared laser. The processing device comprises a laser, a collimating lens, a light beam angle adjusting module and a first light splitting system, which are sequentially distributed along a light path, wherein the laser is 1070+ / -10nm optical-fiber pulse laser, the output end of the first light splitting system is provided with a first focus lens and a second light splitting system, the output end of the second light splitting system is provided with a second focus lens and a reflecting mirror, the output end of the reflecting mirror is provided with a third focus lens, and the first focus lens, the second focus lens and the third focus lens are right opposite to a three-dimensional platform for storing the sapphire glass. The optimized laser beam is used for processing the sapphire glass, the utilization rate of the laser power is increased in a splitting manner, the efficiency is improved, the cost is reduced, and the edge breakage and the heat influence area can be reduced; and the processing device has characteristics of small light spot, high efficiency, low cost and the like.

Description

technical field [0001] The invention relates to a processing device and method for cutting sapphire glass with an infrared laser. Background technique [0002] With the development of science and technology, sapphire glass is more and more widely used in industries such as electronic products and LED lighting. Sapphire glass is composed of single crystal alumina, which is artificially synthesized and formed from long crystal ingots, with a Mohs strength of 9. Compared with ordinary silicate glass, its hardness is higher, and it is mainly used to make watch mirrors of high-end watches. [0003] Sapphire glass has good thermal properties, electrical properties and dielectric properties, and is resistant to chemical corrosion, high temperature resistance, good thermal conductivity, and infrared transmission. Therefore, it is often used to replace other optical materials to make optical components and infrared optical windows, and is widely used in infrared and far infrared mi...

AI Technical Summary

Problems solved by technology

[0007] compared to CO 2 Laser processing, due to its long wavelength, restricted by lens aberration, diffraction and other factors, the processed spot (including the heat-affected zone) is nearly 100um, and the processed sapphire edge micro-cracks are large; for short-wavelength UV laser processing (355nm) and green light (532nm) although the spot is small, due to factors such as nanosecond pulse width, high frequency, low laser power (<50W) and expensive laser, the processing efficiency is low, and the processing thickness is less than 0.8mm

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