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Resin composition, adhesive film and cover film made from the composition

A technology of resin composition and vinyl compound, applied in the direction of film/sheet without carrier, non-polymer organic compound adhesive, epoxy resin glue, etc., to achieve excellent bonding strength, excellent electrical characteristics, and good workability Effect

Active Publication Date: 2016-10-26
NAMICS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, this method has the problem of generating corrosive halogen gas or highly toxic dioxins during combustion

Method used

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  • Resin composition, adhesive film and cover film made from the composition
  • Resin composition, adhesive film and cover film made from the composition
  • Resin composition, adhesive film and cover film made from the composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～12、 comparative example 1～6

[0187] After measuring and preparing each component according to the ratio (parts by mass) shown in the table below, toluene was added, put into a reaction kettle heated to 80° C., and mixed at normal pressure for 3 hours while rotating at a rotation speed of 150 rpm.

[0188] A varnish containing the obtained resin composition was applied to one side of a substrate (a release-treated PET film), and dried at 100°C to obtain a support-attached film.

[0189] The abbreviations in the table are indicated as follows.

[0190] ingredient (A)

[0191] OPE2200: oligophenylene ether (vinyl compound represented by the above general formula (1)) (Mn=2200), manufactured by Mitsubishi Gas Chemical Co., Ltd.

[0192] Ingredients (A')

[0193] S202A: Modified polyphenylene ether (Mn=16000), manufactured by Asahi Kasei Chemical Co., Ltd.

[0194] ingredient (B)

[0195] SEPTON 8007: Styrene-ethylene / butylene block copolymer, manufactured by Kuraray Co., Ltd.

[0196] SEPTON 4044: S...

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Abstract

The purpose of the present invention is to provide a product that can achieve low dielectric constant and low dielectric loss in the frequency range of 1 to 10 GHz, and can meet the electrical / electronic applications of V-0 or VTM-0 based on the flame retardancy of UL94. Adhesive films and cover films, and resin compositions used for making these adhesive films and cover films. The present invention provides a resin composition characterized by containing (A) a vinyl compound having a mass average molecular weight (Mw) represented by the following general formula (1) of 500 to 4000, (B) a thermoplastic elastomer, (C ) a thermosetting resin other than the vinyl compound represented by the aforementioned general formula (1), (D) a curing agent, and (E) an aluminum organic phosphinate, and relative to the aforementioned component (A), the aforementioned component (B), 10-50 mass parts of said components (E) are contained in 100 mass parts of totals of the said component (C), the said component (D), and the said component (E).

Description

technical field [0001] The present invention relates to resin compositions. More specifically, it is related with the resin composition suitable for the adhesive film of an electric / electronic use, or the coverlay film of a printed wiring board. [0002] And this invention relates to the adhesive film and cover film produced using this resin composition. Background technique [0003] In recent years, printed wiring boards used in electrical / electronic equipment have developed toward miniaturization, light weight, and high performance. Especially for multilayer printed wiring boards, there are further requirements for high multilayer, high density, Thinning, lightweight, high reliability and formability, etc. [0004] In addition, in accordance with the demand for high-speed transmission signals in recent printed wiring boards, high-frequency transmission signals are also remarkably advanced. Accordingly, materials used for printed wiring boards are required to reduce elec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/10C08K5/5313C08L53/02C08L71/00C09J11/06C09J171/00C09J201/00C09J7/10
CPCC08K5/5313C09J2203/326C09J2453/00C09J2463/00C09J2471/00C09J163/00C08L53/00C09J7/10C09J2301/408C09J4/06C08F287/00
Inventor 高桥聪子寺木慎吉田真树
Owner NAMICS CORPORATION
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