Diffusion-strengthened copper prepared by nano particle stirring method and preparation method thereof
A technology for dispersion strengthening of copper and nanoparticles, which is used in high-strength, high-wear and high-corrosion-resistant metal materials, and high electrical conductivity. It can achieve the effect of improved mechanical properties, low cost and uniform distribution
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0016] In the embodiment of the present invention, the process flow for preparing dispersion-strengthened copper by nanoparticle stirring method is as follows: modify the surface of nano-alumina, disperse it in ethanol for 40 minutes with silane coupling agent KH570, put it into a planetary ball mill and grind for 3 hours, and complete surface modification. Pack the surface-modified nano-alumina in a copper tube, the content is 0.15wt% of the total weight of the melt, and prepare according to the above ingredients, first add the copper plate to the smelting to 1180-1200 °C, and cover the surface with a layer of charcoal with a thickness of more than 2mm powder, and then add the packaged nano-Al in the melting furnace in the way of dispersed feeding 2 o 3 After stirring, let it stand for 30 minutes, pour it into a horizontal continuous casting holding furnace, and cast it into a slab at a temperature of 1150 ° C. The conductivity of the slab is 91% IACS, the oxygen content is ...
Embodiment 2
[0018] In the embodiment of the present invention, the process flow for preparing dispersion-strengthened copper by nanoparticle stirring method is as follows: modify the surface of nano-alumina, disperse it in ethanol for 30 minutes with silane coupling agent KH570, put it into a planetary ball mill and grind it for 3.5 hours, and complete surface modification. The surface-modified nano-alumina is packaged in a copper tube. The content is 0.35wt% of the total weight of the melt. It is prepared according to the above ingredients. First, the copper plate is added to the melting temperature to 1180-1200 °C, and the surface layer is covered with a layer of charcoal powder with a thickness of more than 2mm. good nano Al 2 o 3 After stirring, let it stand for 30 minutes, pour it into a vertical holding furnace, and cast it into a slab at a temperature of 1150 ° C. The conductivity of the slab is 88% IACS, and the oxygen content is 290ppm. After rolling and deformation, a slab of...
PUM
Property | Measurement | Unit |
---|---|---|
elastic modulus | aaaaa | aaaaa |
strength | aaaaa | aaaaa |
elastic modulus | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com