Silver particle ink, silver particle sintered body and method for manufacturing silver particle ink

Abstract

Provided is a silver particle ink comprising hexylamine, dodecylamine, an oleic acid, silver particles and a solvent, wherein the volume resistivity of a sintered body at 100°C after application to a substrate by spin coating is 8 to 25 muOmega.cm. Also provided are a sintered body of the silver particle ink and a method for manufacturing the silver particle ink. As a result, manufacture can be facilitated when manufacturing the silver particle ink which comprises coated silver particles by a silver amine complex decomposition method, the silver particle ink can be sintered even at low temperatures, the sintered body has a mirror surface, and the volume resistivity is small.

Description

technical field [0001] The present invention relates to a method for producing silver microparticle ink, silver microparticle ink and silver microparticle sintered body produced by the method, the silver microparticle ink containing nano-sized coated silver exhibiting good conductivity by sintering on the upper surface of a substrate or the like particle. Background technique [0002] For example, along with demands for smaller, thinner, and lighter electronic devices and improved productivity, printed wiring boards on which electronic components are mounted require faster and higher-density mounting of materials for forming conductive lines. [0003] In response to this, attempts are being made to form silver circuits at lower temperatures by, for example, inkjet printing techniques using inks in which nano-sized silver particles are dispersed. [0004] In this case, it is considered to print the desired circuit shape with an ink containing silver particles, and to combine...

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Problems solved by technology

[0009] The average particle size of the silver ultrafine particle colloid is 1-20 nm, is monodisperse, and is polygonal with a uniform shape, and is suitable for materials such as low-temperature sinterable alkaline pastes, but the specific sintering temperature is not disclosed. However, according to the experiments of the present inventors, it was found that the sintering temperature still far exceeds 100°C.

[0010] In addition, the surface roughness of the sintered bodies of Patent Documents 1 and 2 is not disclosed, and both of the surfaces are in a matte state. In addition, it has been confirmed that when the film thickness in terms of weight is about 500 nm, the sintered The volume resistivity of the body exceeds 30μΩ·cm

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