Silver particle ink, silver particle sintered body and method for manufacturing silver particle ink

A manufacturing method and technology of silver particles, which are applied in cable/conductor manufacturing, ink, printed circuit manufacturing, etc., can solve the problems of undisclosed sintering temperature and undisclosed surface roughness of sintered body.

A manufacturing method and technology of silver particles, which are applied in cable/conductor manufacturing, ink, printed circuit manufacturing, etc., can solve the problems of undisclosed sintering temperature and undisclosed surface roughness of sintered body.

CN104540904AActive Publication Date: 2015-04-22TANAKA PRECIOUS METAL IND
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  • Silver particle ink, silver particle sintered body and method for manufacturing silver particle ink
  • Silver particle ink, silver particle sintered body and method for manufacturing silver particle ink
  • Silver particle ink, silver particle sintered body and method for manufacturing silver particle ink

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0054] Examples of the present invention will be specifically described below.

[0055] Silver particle inks described in the examples were produced in the following manner.

[0056] In the first process, N,N-dimethyl-1,3-diaminopropane is mixed with silver oxalate wetted by 30-200 wt% organic solvent to form N,N-dimethyl -1,3-diaminopropane coordination silver complex. In the second step, hexylamine (6 carbon atoms) and dodecylamine (12 carbon atoms) and oleic acid (19 carbon atoms) as a fatty acid are added to the mixture of the first step and kneaded.

[0057] Specifically, in the first step, silver oxalate is synthesized from silver nitrate and oxalic acid dihydrate, and an organic solvent is added thereto. In this example, the alkylamine was added so that the molar amount of all the alkylamines was approximately 4 to 6 times the molar amount of the silver oxalate. Since there are two silver atoms in the silver oxalate molecule, the amount of the above-mentioned alkylam...

experiment example

[0069] Table 1 shows Experimental Examples 1 to 15. In addition, Comparative Examples 1-8 are shown in Table 2.

[0070]

[0071]

[0072] Experimental Examples 1 to 8 and Comparative Examples 2 to 4 investigated the wetting by various organic solvents, Comparative Example 1 was not wetted, and Experimental Examples 9 to 12 and Comparative Example 8 investigated the types of organic solvents finally dispersed. In Experimental Examples 13-15 and Comparative Examples 5-7, the addition amount of N,N-dimethyl-1,3-diaminopropane, hexylamine, dodecylamine, and oleic acid relative to silver oxalate was studied, and A silver particle ink was prepared.

[0073] In Experimental Examples 1 to 15, silver particle inks could be synthesized, and they were stable inks that did not form precipitation for more than one month. On the other hand, in Comparative Example 2, the synthesis of silver fine particles could not be achieved, and no ink was obtained. In addition, in Comparative E...

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Abstract

Provided is a silver particle ink comprising hexylamine, dodecylamine, an oleic acid, silver particles and a solvent, wherein the volume resistivity of a sintered body at 100°C after application to a substrate by spin coating is 8 to 25 muOmega.cm. Also provided are a sintered body of the silver particle ink and a method for manufacturing the silver particle ink. As a result, manufacture can be facilitated when manufacturing the silver particle ink which comprises coated silver particles by a silver amine complex decomposition method, the silver particle ink can be sintered even at low temperatures, the sintered body has a mirror surface, and the volume resistivity is small.

Description

technical field [0001] The present invention relates to a method for producing silver microparticle ink, silver microparticle ink and silver microparticle sintered body produced by the method, the silver microparticle ink containing nano-sized coated silver exhibiting good conductivity by sintering on the upper surface of a substrate or the like particle. Background technique [0002] For example, along with demands for smaller, thinner, and lighter electronic devices and improved productivity, printed wiring boards on which electronic components are mounted require faster and higher-density mounting of materials for forming conductive lines. [0003] In response to this, attempts are being made to form silver circuits at lower temperatures by, for example, inkjet printing techniques using inks in which nano-sized silver particles are dispersed. [0004] In this case, it is considered to print the desired circuit shape with an ink containing silver particles, and to combine...

Claims

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Application Information

Patent Timeline
22 Apr 2015
Publication
CN104540904A
IPC
C09D11/52; B22F9/00; B22F9/30; H01B1/00; H01B1/22; H01B13/00; B22F1/102; B22F1/103
CPC
H01B1/22; B22F1/0062; C09D11/52; B22F1/102; B22F1/103; B22F9/30; B22F2998/10; Y10T428/268
Inventors
久保仁志; 大岛优辅