Method for preparing PCB (Printed Circuit Board) aluminum foils by using cast-rolled slabs

A casting and rolling, aluminum foil technology, applied in metal rolling and other directions, can solve the problems of poor surface cleanliness, high surface hardness of aluminum foil, low heat dissipation efficiency, etc., to reduce the intermediate annealing process, moderate surface hardness, and conduction efficiency. improved effect

Active Publication Date: 2015-04-29
JIANGSU DINGSHENG NEW MATERIAL JOINT STOCK CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, 1100 and 8011 alloys are used as ordinary aluminum cover plates in China. The aluminum foil used for ordinary aluminum cover plates has high surface hardness, poor quality, low heat dissipation efficiency, and poor surface cleanliness. The technical requirements for aluminum-based composite coating cannot be applied, and only Due to the lack of coating on the surface, large-aperture drilling is required for ordinary circuit boards. When drilling, the positioning accuracy is poor, and scratches are easy to occur, resulting in drill bit slippage and easy needle breakage; it cannot meet the technical requirements for micro-drilling of electronic aluminum foil for high-end PCB coating.

Method used

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  • Method for preparing PCB (Printed Circuit Board) aluminum foils by using cast-rolled slabs
  • Method for preparing PCB (Printed Circuit Board) aluminum foils by using cast-rolled slabs

Examples

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Embodiment 1

[0033] The method for preparing aluminum foil for PCB by using a cast-rolled slab comprises the following steps:

[0034](1) Smelting, casting and rolling: 1050 aluminum alloy is used for smelting, casting and rolling into blanks, and the thickness of the blanks is 6.5-6.9mm. The process of smelting and casting and rolling must be clean of deslagging and degassing to ensure uniform composition. The melting temperature is less than 770°C, and the temperature of the guide furnace is 750±10°C. During the melting process, electromagnetic stirring is used to fully stir the melt to ensure uniform composition. During the casting and rolling process, the rotary blowing method is used for online degassing , and use 30 PPi+40 PPi two-stage plate filter method to filter the melt to ensure that the hydrogen content in the melt is ≤0.15ml / 100g.Al, and the vertical plate and production adopt a small casting and rolling area and a low rolling speed , to reduce the precipitation of supersatur...

Embodiment 2

[0041] The method for preparing aluminum foil for PCB by using a cast-rolled slab comprises the following steps:

[0042] (1) Smelting, casting and rolling: 1060 aluminum alloy is used for smelting, casting and rolling into blanks, and the thickness of the blanks is 6.5-6.9mm. The process of smelting and casting and rolling must be clean of deslagging and degassing to ensure uniform composition. The melting temperature is less than 770°C, and the temperature of the guide furnace is 750±10°C. During the melting process, electromagnetic stirring is used to fully stir the melt to ensure uniform composition. During the casting and rolling process, the rotary blowing method is used for online degassing , and use 30 PPi+50 PPi two-stage plate filter to filter the melt to ensure that the hydrogen content in the melt is ≤0.15ml / 100g.Al, and use small casting and rolling areas and low rolling speeds for vertical plates and production , to reduce the precipitation of supersaturated soli...

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Abstract

The invention discloses a method for preparing PCB (Printed Circuit Board) aluminum foils by using cast-rolled slabs. The method comprises the following steps: (1) smelting, casting and rolling 1050 or 1060 aluminum alloys; (2) roughly rolling, intermediately rolling, longitudinally shearing edges; (3) finely rolling; (4) washing and straightening; (5) cutting, checking and packing to obtain PCB electronic aluminum foils. The mechanical property control deltab of PCB electronic aluminum foils prepared by the method is 190-230MPa; the extension ratio of the PCB electronic aluminum foils is larger than or equal to 2%; the surface hardness value is smaller than 60HV.

Description

technical field [0001] The invention relates to a method for preparing aluminum foil for PCB by using a cast-rolled slab, and belongs to the technical field of metal material processing methods. Background technique [0002] Aluminum foil for high-end PCB is used in the PCB drilling process through aluminum-based composite materials. The circuit board is drilled with a drilling machine to drill out the conduction channels of the interlayer circuit and the fixing holes of the welding parts. When drilling, it is placed under the circuit board. The plate-shaped backing material that is in direct contact with the machine table is called a backing plate; it is a material that is placed under the board to be processed when the printed board is mechanically drilled to meet the processing requirements. When the circuit board is drilled, that is, when the PCB is drilled, the plate placed on the copper clad laminate to be processed is called a "cover plate". , to meet the requirement...

Claims

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Application Information

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IPC IPC(8): B21B1/40B23P15/00
CPCB21B1/40B23P15/00
Inventor 万宝伟董则防张莉莘明哲吴保剑陆佳曾元
Owner JIANGSU DINGSHENG NEW MATERIAL JOINT STOCK CO LTD
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