Sn-Cu high-temperature lead-free soldering paste, preparation method thereof and application method thereof

A lead-free solder paste, sn-cu technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve the problem of not being able to provide such products, and achieve the effects of improved mechanical properties, low cost, and simple preparation methods

Inactive Publication Date: 2015-05-06
NORTHEASTERN UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such products are not currently available in the market

Method used

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  • Sn-Cu high-temperature lead-free soldering paste, preparation method thereof and application method thereof
  • Sn-Cu high-temperature lead-free soldering paste, preparation method thereof and application method thereof
  • Sn-Cu high-temperature lead-free soldering paste, preparation method thereof and application method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Spherical or nearly spherical copper powder with a particle size of 0.1 μm and tin powder with a particle size of 1 μm were added with rosin-type flux with a viscosity of 1 Pa·s, and mechanically mixed for 15 minutes at a speed of 1000 rpm by a high-speed mixer to obtain the obtained Solder paste is required; the mass percentage of each component of the solder paste is copper: tin: disproportionated rosin flux 40%: 40%: 20%.

[0036] Take 2 groups of copper sheet weldments, and apply the solder paste prepared above evenly on these 2 groups of copper sheet weldments; Group A heat treatment at 250-300 ° C for 2 hours in an argon atmosphere, and cool with the furnace; Group B in argon atmosphere Heat treatment at 250-300°C for 2 hours in the atmosphere, and at the same time, use a hot press to apply a pressure of 5 MPa to the weldment to the area where the solder paste is applied, and cool with the furnace;

[0037]Take out the weldment, and test the shear strength of the ...

Embodiment 2

[0039] Spherical or nearly spherical copper powder with a particle size of 1 μm and tin powder with a particle size of 5 μm were added with rosin-type flux with a viscosity of 8 Pa s, and mechanically mixed for 10 minutes at a speed of 1800 rpm by a high-speed mixer to obtain the obtained Solder paste is required; the mass percentage of each component of the solder paste is, copper: tin: disproportionated rosin flux is 20%: 60%: 20%.

[0040] Take 2 groups of copper sheet weldments, and apply the solder paste prepared above evenly on the 2 groups of copper sheet weldments; group A is heat treated at 250-300°C in a nitrogen atmosphere for 1 hour; group B is heat-treated at 250-300°C in a nitrogen atmosphere 1h, at the same time, use a hot press to apply a pressure of 6MPa to the weldment to the area where the solder paste is applied;

[0041] Take out the weldment, and test the shear strength of the weld of the welded sample at 350°C with a universal mechanical testing machine ...

Embodiment 3

[0043] Spherical or nearly spherical copper powder with a particle size of 0.2 μm and tin powder with a particle size of 2 μm were added with rosin-type flux with a viscosity of 3 Pa s, and mechanically mixed for 12 minutes at a speed of 1500 rpm by a high-speed mixer to obtain the obtained Solder paste is required; the mass percentage of each component of the solder paste is, copper: tin: natural rosin flux is 35%: 50%: 15%.

[0044] Take 2 groups of copper sheet weldments, and apply the solder paste prepared above evenly on the 2 groups of copper sheet weldments; group A heat treatment at 250-300 °C for 6 hours in an argon atmosphere; group B in an argon atmosphere at 250-300 ℃ heat treatment for 6 hours, and at the same time, use a hot press to apply a pressure of 7 MPa to the weldment to the area where the solder paste is applied;

[0045] Take out the weldment and test the shear strength of the weld of the welded sample at 350°C with a universal mechanical testing machine...

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Abstract

In order to solve the problems that soldering paste which is environmentally friendly, low in cost and reliable in welding joint under a high-temperature working environment does not exist at present, the invention provides a Sn-Cu lead-free soldering paste, a preparation method of the soldering paste and an application method of the soldering paste and belongs to the field of electronic packaging materials. The soldering paste is composed of tin powder, copper powder and rosin flux. The preparation method includes the steps that the rosin flux is added into the tin powder and the copper powder; next, the tin powder and the copper powder are mechanically mixed through a blender mixer for 10-15 min at the speed of 1,000-1,800 turns/min, and then the soldering paste is obtained. When the working temperature in the air is lower than 350 DEG C, the welding seam shear strength of the high-temperature lead-free soldering paste is greater than or equal to 10 MPa. If pressure of 5-10 MPa is exerted from the outside in the heat treatment process of a welding piece, the welding seam shear strength of the high-temperature lead-free soldering paste is greater than or equal to 20 MPa. The use temperature of samples welded through the soldering paste can reach as high as 400 DEG C, and the soldering paste is high in welding seam shear strength, simple in welding process, stable in performance and low in cost.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging and welding, and in particular relates to a Sn-Cu high-temperature lead-free solder paste that maintains high strength at high temperatures, a preparation method and a use method thereof. Background technique [0002] With the development of the microelectronics industry, the temperature of the working environment of electronic components is getting higher and higher. It is necessary to develop a series of environmentally friendly and reliable high-temperature soldering materials to adapt to the development of the microelectronics industry. At the same time, in order to meet the increasing demand for high-temperature electronic components, new-generation semiconductors such as SiC, GaN and packaging materials AlN, Si 3 N 4 It has been widely used, but the development of low-cost, high-performance high-temperature solder for electronic packaging, which is one of the key technologies, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/24B23K35/363B23K35/40B23K1/008
CPCB23K35/24B23K1/008B23K35/362B23K35/40
Inventor 孙旭东黄宏伟刘绍宏石帅朋易伟朱晓丽
Owner NORTHEASTERN UNIV
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