A reinforced phenolic glass fiber molding compound

Abstract

The invention discloses an enhanced phenolic glass fiber mold plastic. The mold plastic is prepared by the following steps: performing dip-coating on a mold plastic resin system and glass fibers, drying, thereby obtaining the mold plastic. The mold plastic resin system is prepared from a diamine type phosphorus-containing high flame resistance benzoxazine resin, nanometer SiO2, KH550, methyl tetrahydrophthalic anhydride, dimethyl formamide and methanol. Compared with the traditional composite material, the mold plastic disclosed by the invention has the advantages that an organic phase and an inorganic phase are compounded in a nanometer range, the interfacial area between the organic phase and the inorganic phase is extremely large, chemical bonding or sub-chemical bonding between the interfaces is formed, ideal binding force is formed, the problem that the thermal expansion coefficient between the two phases is mismatched is eliminated, and the rigidity, dimensional stability, thermal stability and flame retardance of inorganic matters and the toughness, machinability and dielectric properties of organic polymers are integrated together, so that most of traditional insulation engineering mold plastics cannot reach novel performances.

Description

technical field [0001] The invention relates to a reinforced phenolic glass fiber molding compound. Background technique [0002] At present, the heat protection technology and heat protection structure adopted by my country's missiles, fighter jets, and aerospace vehicles basically follow the polyvinyl alcohol modified phenolic glass fiber molding compound used in the 1970s. This kind of molding compound has long molding time, poor mechanical properties, low electrical insulation strength, high production cost, serious environmental pollution, and unreasonable stress on cable core wires and plugs after installation, which reduces the reliability of missiles and aerospace vehicles. . In order to adapt to the development of national defense and military industry, it is urgent to develop and produce high-grade advanced composite materials matching it. Contents of the invention [0003] The purpose of the present invention is to provide a combination of the rigidity, dimens...

AI Technical Summary

Problems solved by technology

This kind of molding compound has long molding time, poor mechanical properties, low electrical insulation strength, high production cost, serious environmental pollution, and unreasonable stress on cable core wires and plugs after installation, which reduces the reliability of missiles and aerospace vehicles.

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