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A kind of preparation method of the acrylic acid modified epoxy resin that is used for LED encapsulation

A technology of LED packaging and acrylic resin, which is applied in the direction of epoxy resin glue, adhesive type, adhesive additive, etc., can solve the problems of easy yellowing, low glass transition temperature, and poor UV resistance, and achieve good durability Performance of UV lamps, effect of high glass transition temperature

Inactive Publication Date: 2016-08-24
SPIMAGE XIAMEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is: the epoxy resin used for LED packaging has the problems of poor UV resistance, easy yellowing, and low glass transition temperature. The preparation method of the epoxy resin has been improved, mainly by using Modification of epoxy resin by acrylic acid significantly improves the encapsulation performance

Method used

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  • A kind of preparation method of the acrylic acid modified epoxy resin that is used for LED encapsulation
  • A kind of preparation method of the acrylic acid modified epoxy resin that is used for LED encapsulation

Examples

Experimental program
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Embodiment 1

[0038] The 1st step, the preparation of the acrylic resin that side chain has maleic anhydride group: 20g of maleic anhydride, 10g of hydroxypropyl acrylate, 20g of butyl acrylate, 15g of styrene, 3g of dicumyl peroxide are mixed uniformly, As the first mixed solution; mix xylene 70g and dicumyl peroxide 1g uniformly, as the second mixed solution, after the second mixed solution is heated to reflux state, start to drop the first mixed solution, after the dropwise addition , heat preservation at reflux temperature for 1.5 hours, after the heat preservation is completed, the material will be cooled and discharged at a temperature of 95°C to obtain an acrylic resin with a maleic anhydride group in the side chain;

[0039] Step 2, mix 70g of epoxy resin, acrylic resin with maleic anhydride group in the chain, 4g of terpene resin, and 3g of catalyst (dibutyltin dilaurate) evenly, then heat up to 95°C, heat preservation, heat preservation time 3 hour, finish the reaction, that’s it....

Embodiment 2

[0041] The 1st step, the preparation of the acrylic resin that side chain has maleic anhydride group: 30g of maleic anhydride, 20g of hydroxypropyl acrylate, 30g of butyl acrylate, 20g of styrene, 5g of dicumyl peroxide are mixed uniformly, As the first mixed solution; mix xylene 140g and dicumyl peroxide 2g evenly, as the second mixed solution, after the second mixed solution is heated to reflux state, start to drop the first mixed solution, after the dropwise addition , keep warm at the reflux temperature for 2.5 hours, after the heat preservation is over, cool down and discharge the material, and the cool down temperature is 105°C, and the acrylic resin with maleic anhydride groups in the side chain is obtained;

[0042] Step 2, mix 100g of epoxy resin, acrylic resin with maleic anhydride group in the chain, 8g of terpene resin, and 5g of catalyst (dibutyltin dilaurate), and then heat up. Hours, the reaction is over, the condition for ending the reaction is: take a sample t...

Embodiment 3

[0044] The 1st step, the preparation of the acrylic resin that side chain has maleic anhydride group: 25g of maleic anhydride, 15g of hydroxypropyl acrylate, 25g of butyl acrylate, 17g of styrene, 4g of dicumyl peroxide are mixed uniformly, As the first mixed solution; mix xylene 100g and dicumyl peroxide 2g evenly, as the second mixed solution, after the second mixed solution is heated to reflux state, start to drop the first mixed solution, after the dropwise addition , heat preservation at reflux temperature for 2 hours, after the heat preservation is completed, the material will be cooled and discharged at a temperature of 100°C to obtain an acrylic resin with a maleic anhydride group in the side chain;

[0045] Step 2, mix 80g of epoxy resin, acrylic resin with maleic anhydride group in the chain, 7g of terpene resin, and 4g of catalyst (dibutyltin dilaurate) evenly, then heat up, heat up at 100°C, keep warm for 4 hour, finish the reaction, that’s it. The conditions for e...

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Abstract

The invention relates to a preparation method of acrylic acid modified epoxy resin for LED packaging and belongs to the technical field of LED packaging. The method comprises the following steps: uniformly mixing maleic anhydride, hydroxy propyl acrylate, butyl acrylate, phenethylene and dicumyl peroxide to obtain a first mixed solution; uniformly mixing an organic solvent and dicumyl peroxide to obtain a second mixed solution, starting to dropwise add the first mixed solution after the second mixed solution is heated to a reflux state, performing heat preservation at a reflux temperature after all the first mixed solution is dropwise added, and cooling and discharging after heat preservation is over to obtain acrylic resin with side chains with maleic anhydride groups; and uniformly mixing epoxy resin, acrylic resin with side chains with maleic anhydride groups, terpene resin and a catalyst, then performing heating and heat preservation, and obtaining acrylic acid modified epoxy resin after reaction is over. The epoxy resin for LED packaging, provided by the invention, has high glass transition temperature and high ultra-violet lamp resistance after being modified acrylic resin and terpene resin.

Description

technical field [0001] The invention relates to a method for preparing an acrylic-modified epoxy resin used for LED packaging, and belongs to the technical field of LED packaging. Background technique [0002] The semiconductor LED packaging industry occupies the dominant position in the domestic integrated circuit industry, and how to choose electronic packaging materials is more important. According to data, more than 90% of transistors and 70% to 80% of integrated circuits have used plastic packaging materials, and epoxy resin packaging plastic powder is the most common plastic packaging material. [0003] Semiconductor packaging enables such as diodes, transistors, ICs, etc. to maintain their own airtightness, protect them from the influence of humidity and temperature in the surrounding environment, and prevent electronic components from being damaged by mechanical vibration and impact, resulting in changes in component characteristics. Therefore, the purpose of packag...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J133/08C09J135/00C09J11/08C09J11/06
Inventor 潘小和
Owner SPIMAGE XIAMEN CO LTD