Layer-shaped high thermal conductive and insulating base plate and preparation method thereof

Abstract

The invention discloses a layer-shaped high thermal conductive and insulating base plate and a preparation method thereof, and belongs to the technical field of electronics. The high thermal conductive and insulating base plate is composed of a high thermal conductive composite material base body and an insulating film layer deposited on the high thermal conductive composite material base body; the high thermal conductive and insulating base plate is prepared by depositing the insulating film layer on the surface by adopting a physical or chemical method on the basis of the high thermal conductive composite material base body. The insulating base plate has the high thermal conductivity, the low-grade fever expansion factor, the high intensity and a good size stability performance, and further has the high disruptive strength, the high dielectric constant and other characters. According to the high thermal conductive and insulating base plate, the requirement of insulating function is met when an electronic packaging base plate is on the basis of maintaining a good heat dissipation of a base material.

Description

technical field [0001] The invention belongs to the field of electronic technology, in particular to a layered high thermal conductivity insulating substrate and a preparation method thereof. Background technique [0002] Due to the rapid increase in the integration of integrated circuits, the heat generated by the chip has risen sharply, which has reduced the life of the chip. The reason is that in microelectronic integrated circuits and high-power rectifier devices, thermal fatigue caused by poor heat dissipation between materials and Caused by thermal stress caused by thermal expansion coefficient mismatch. The key to solving this problem is to carry out reasonable encapsulation. Judging from the current development trend of electronic packaging technology, various packaging materials with a single substrate cannot meet the comprehensive requirements of various performances. Metal matrix composites can fully meet the above requirements. It is especially suitable for po...

AI Technical Summary

Problems solved by technology

[0004] The traditional high thermal conductivity insulating substrate is the metal substrate of the prepreg in the copper clad laminate production method as the insulating layer, such as the prepreg using epoxy-glass cloth base (FR-4) (the thermal conductivity is only 0.3W / m·K), but this There is no thermal conductive filler added to the insulating layer. The insulating layer of this substrate does not have high thermal conductivity, nor does it have high-strength electrical insulation properties.

In addition, the selected insulating material can be coated on the surface of the treated metal sheet by spraying, scraping, brushing or printing to form a semi-solid adhesive film, and then laminated with copper foil. , forming a metal substrate by high-temperature pressing; or making the insulating material system used into a semi-cured insulating dielectric film first, and then laminating it with copper foil to form a metal substrate by high-temperature pressing, but the insulating materials The thermal conductivity is very low, which cannot meet the needs of high thermal conductivity of the substrate. Therefore, in order to have high thermal conductivity and good insulation performance at the same time, and meet the high performance requirements of electronic equipment, it is necessary to find a new preparation method for high thermal conductivity and insulating composite materials. Important practical value and broad application prospects

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