Single particle layer nano-diamond film and preparation method thereof
A nano-diamond and single-particle technology, which is applied in the direction of coating, metal material coating process, gaseous chemical plating, etc., can solve the problems that do not involve single-particle layer nano-diamond film, etc., and achieve the effect of simple scheme and easy operation
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Embodiment 1
[0024] Polish the monocrystalline silicon wafer with nano-scale diamond powder, and the grinding time is about half an hour. Polished silicon wafers were ultrasonically cleaned with deionized water and acetone in turn, dried, and used as substrates for the growth of nano-diamond films. The hot wire chemical vapor deposition method (chemical vapor deposition equipment was purchased from Shanghai Jiaoyou Diamond Coating Co., Ltd., model JUHF CVD 001) was used, acetone was used as the carbon source, and acetone was brought into the reaction chamber by hydrogen bubbling. The flow ratio to acetone is 200:90, the distance between the hot wire and the substrate silicon wafer is 7mm, the reaction power is 2200W, and the working pressure is 1.63Kpa; no bias is applied during the reaction, and the preparation time is 15 minutes; after the growth , the temperature of the sample is cooled under the condition of no hydrogen gas, and a single particle layer nano-diamond film with a thicknes...
Embodiment 2
[0029] The monocrystalline silicon wafer is polished with nanometer diamond powder, and the polishing time is about half an hour. The polished silicon wafers were washed with deionized water and acetone in an ultrasonic machine, dried, and used as substrates for the growth of nano-diamond films. The hot wire chemical vapor deposition method (chemical vapor deposition equipment was purchased from Shanghai Jiaoyou Diamond Coating Co., Ltd., model JUHF CVD 001) was used, acetone was used as the carbon source, and acetone was brought into the reaction chamber by hydrogen bubbling. The flow ratio with acetone is 200:90, the distance between the hot wire and the substrate silicon wafer is 7mm, the reaction power is 2000W, and the working pressure is 1.63Kpa; no bias is applied during the reaction process, and the film preparation time is 30 minutes. After the growth, the sample was cooled down without hydrogen.
[0030] Figure 5 For the cross-sectional SEM image of the sample, it c...
Embodiment 3
[0032] The monocrystalline silicon wafer is polished with nanometer diamond powder, and the polishing time is about half an hour. The polished silicon wafers were washed with deionized water and acetone in an ultrasonic machine, dried, and used as substrates for the growth of nano-diamond films. The hot wire chemical vapor deposition method (chemical vapor deposition equipment was purchased from Shanghai Jiaoyou Diamond Coating Co., Ltd., model JUHF CVD 001) was used, acetone was used as the carbon source, and acetone was brought into the reaction chamber by hydrogen bubbling. The flow ratio with acetone is 200:90, the power is 1700W, the distance between the hot wire and the substrate silicon wafer is 7mm, the working pressure is 1.63Kpa, no bias is applied during the reaction process; the preparation time is 40 minutes; after the growth is over, The sample was cooled down under the condition of not flowing hydrogen.
[0033] Figure 6 From the cross-sectional SEM image of ...
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