Teflon-based doped high thermal stability heat dissipation material for LED light source and preparation method thereof

Abstract

The invention relates to a teflon-basedd doped high thermal stability heat dissipation material for an LED light source and a preparation method thereof. The material consists of the following raw materials by weight: 0.2-0.4 part of carbon nanotube, 2-4 parts of graphite flake, 3-5 parts of mullite powder of 400-600 mesh, 5-6 parts of nano-silica sol with solid content of 10-15%, 2-4 parts of poly-p-phenylene terephthalamide, 3-5 parts of sodium silicate, 1-3 parts of gamma-aminopropyl triethoxysilane, 1-2 parts of polyethylene glycol, 30-40 parts of water, 20-25 parts of aluminum nitride powder of 400-600 mesh, 40-50 parts of PTFE powder of 200-300 mesh, and 2-3 parts of an additive. The heat dissipation material provided by the invention has the advantages of efficient, uniform, and stable thermal conductivity, resistance to environmental corrosion, light and thermal ageing during usage, and easiness to processing cutting, and is an environment-friendly efficient heat dissipation material for LED light fixture.

Description

technical field [0001] The invention relates to an LED heat dissipation material, in particular to a polytetrafluoroethylene base-doped heat dissipation material with high thermal stability for an LED light source, a preparation method and a production method thereof. Background technique [0002] LED is the abbreviation of light-emitting diode. It is a semiconductor electronic component that converts electrical energy into light energy. It has the advantages of small size, long life, low power consumption, fast response, high luminous efficiency, energy saving and environmental protection. It is recognized in the industry As the most competitive product to replace traditional light sources, it has also been widely used in real life. There are still many problems in current LED products, among which heat dissipation has always been the top priority. Common heat dissipation materials are mostly high thermal conductivity metals. , high thermal conductivity inorganic materials,...

AI Technical Summary

Problems solved by technology

[0002] LED is the abbreviation of light-emitting diode. It is a semiconductor electronic component that converts electrical energy into light energy. It has the advantages of small size, long life, low power consumption, fast response, high luminous efficiency, energy saving and environmental protection. It is recognized in the industry As the most competitive product to replace traditional light sources, it has also been widely used in real life. There are still many problems in current LED products, among which heat dissipation has always been the top priority. Common heat dissipation materials are mostly high thermal conductivity metals. , high thermal conductivity inorganic materials, and these materials are compounded and sintered. These materials have disadvantages such as difficult cutting and forming, high cost, and easy to be corroded by the environment. Excellent heat dissipation effect, and can improve the environmental adaptability of the material to achieve efficient and stable performance