Method for preparing germanium on insulating layer by ge film bonding
A germanium and thin-film technology on an insulating layer, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of surface micro-voids and fragility, and achieve reduced fragility, low cost, and reduced chip fragmentation The effect of the risk
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[0028] The following examples will further illustrate the present invention.
[0029] 1. First, use SRIM 2008 software (Stopping and Range of Ions in Matter) to simulate the projected range of hydrogen ions at different energies, and then determine the implantation energy of hydrogen ions according to the required Ge thickness of the top layer of GOI. Deposit 90nm SiO on its surface by PECVD before implantation 2 , as a protective layer for hydrogen ion implantation. Then, hydrogen ions were implanted with LC-4 high-energy ion implanter at room temperature, and the implantation dose was 5×10 16 cm -2 , the injection energy is 250keV. The vacuum level of the target chamber during injection is 10 -6 Torr, the ion beam deviates from the sample normal by 7° to avoid channeling; at the same time, in order to prevent the self-heating effect caused by excessive beam current, the ion beam current density is controlled at 0.8μA / cm 2 about. After injection, dilute the SiO on the s...
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