Preparation method and application of composite heat-dissipating material

Abstract

The invention discloses a preparation method of a composite heat-dissipating material. The preparation method includes stirring and dispersing all raw materials for 1-2 hours, and putting the raw materials into a ball mill for ball-milling treatment to enable the sieving residue per ten thousands of holes of an obtained material is not larger than 0.05%; melting and extruding the obtained evenly-mixed material by a screw extruder, and pulling, cooling and dicing the evenly-mixed material to obtain the composite heat-dissipating material. The preparation method has the advantages that branched chains PA6 with high melt fluidity and substantial active end groups are introduced, excellent melt fluidity and easiness in processing are achieved, dispersion of the heat-dissipating material in a base body is promoted effectively, dipping property and compatibility of fire retardants are improved, and the raw materials are completely wrapped and dispersed in the base body; heat conductivity of the heat-dissipating material is improved and swelling coefficient of the heat-dissipating material is reduced through addition of nano-diamonds, and accordingly, product service life is prolonged; the heat-dissipating material is particularly applicable to production of lampshades, support bases, substrates, low-voltage appliance covers and members of LED illumination products, electronic packaging members, IC (integrated circuit) chips, high-power electromechanical device members and the like.

Description

technical field [0001] The invention relates to a heat dissipation material, in particular to a preparation method and application of a composite heat dissipation material. Background technique [0002] Due to the advantages of wide sources, low cost, and easy processing and molding, polymer materials have been widely used, but generally polymer materials are thermal insulators, which limits their applications in electronic packaging, chemical heat transfer and other fields. In particular, more and more polymer materials are put into the production of LED products, and the low thermal conductivity prevents polymer materials from being further applied to the parts of LED lighting products with high heat generation. At present, there are two main ways to improve the thermal conductivity of polymer materials: one is to synthesize intrinsic polymers with high thermal conductivity, such as polyacetylene, polypyrrole, etc. transfer to realize heat transfer; the second is to p...

AI Technical Summary

Problems solved by technology

However, if it is directly used as a heat sink material, the cost is high, the brittleness is large, and the thermal expansion coefficient is nearly 4 times that of tungsten.