Electronic equipment casing material and preparation method thereof

A shell material and technology for electronic equipment, applied in the field of shell materials of electronic equipment and their preparation, can solve the problems of heavy shell material, poor temperature resistance and flame retardancy, and high shrinkage rate, and achieve high melt flow index and flame retardant. Stable performance and low shrinkage effect

Active Publication Date: 2015-09-09
HISENSE VISUAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a housing material for electronic equipment and a preparation method thereof, which are used to solve technical

Method used

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  • Electronic equipment casing material and preparation method thereof
  • Electronic equipment casing material and preparation method thereof
  • Electronic equipment casing material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] The shell material of this embodiment is made of the following raw material components in parts by weight: 30 parts of polyphenylene ether, 70 parts of high-impact polystyrene, 8 parts of decabromodiphenylethane, 1.5 parts of antimony trioxide, bromo 0.5 part of triazine, 3 parts of tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate] pentaerythritol ester, 0.6 part of calcium stearate, 0.4 part of polyethylene wax, carbon black powder 1 serving.

[0038] The preparation method of the shell material is:

[0039] Add 30 parts of polyphenylene ether, 70 parts of high-impact polystyrene, 0.6 part of calcium stearate and 0.4 part of polyethylene wax into a high-speed mixer, stir and mix to obtain a premix.

[0040] Add 8 parts of decabromodiphenylethane, 1.5 parts of antimony trioxide, 0.5 parts of bromotriazine, 3 parts of tetrakis[β-(3,5-di-tert-butyl-4-hydroxy Phenyl) propionate] pentaerythritol ester and 1 part of carbon black powder, stir and mix to prepare a m...

Embodiment 2

[0044] The shell material of this embodiment is made of the following raw material components by weight: 55 parts of polyphenylene ether, 60 parts of high-impact polystyrene, 4 parts of triphenyl phosphate, bisphenol A-bis (diphenyl phosphate ) 6 parts, 2 parts of decabromodiphenylethane, 3 parts of tetrakis [β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate] pentaerythritol ester, β-(3,5-di 1 part of tert-butyl-4-hydroxyphenyl) n-octadecyl propionate, 1.5 parts of calcium stearate, 0.5 parts of polyethylene wax, and 2 parts of carbon black powder.

[0045] The preparation method of the shell material is:

[0046] Add 55 parts of polyphenylene ether, 60 parts of high-impact polystyrene, 1.5 parts of calcium stearate and 0.5 parts of polyethylene wax into a high-speed mixer, stir and mix to obtain a premix.

[0047] Add 4 parts of triphenyl phosphate, 6 parts of bisphenol A-bis(diphenyl phosphate), 2 parts of decabromodiphenylethane, 3 parts of tetrakis[β-(3,5- Di-tert-butyl-4...

Embodiment 3

[0051] The shell material of this embodiment is made of the following raw material components by weight: 70 parts of polyphenylene ether, 40 parts of high-impact polystyrene, 5 parts of triphenyl phosphate, bisphenol A-bis (diphenyl phosphate ) 6 parts, 4 parts of decabromodiphenylethane, tetrakis [β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate] 3 parts of pentaerythritol ester, β-(3,5-di 1 part of n-octadecyl alcohol ester of tert-butyl-4-hydroxyphenyl) propionate, 1 part of tris[2.4-di-tert-butylphenyl] phosphite, 1.8 parts of calcium stearate, 1.2 parts of polyethylene wax , 2 parts of charcoal black powder.

[0052] The preparation method of the shell material is:

[0053] Add 70 parts of polyphenylene ether, 40 parts of high-impact polystyrene, 1.8 parts of calcium stearate and 1.2 parts of polyethylene wax into a high-speed mixer, stir and mix to obtain a premix.

[0054] Add 5 parts of triphenyl phosphate, 6 parts of bisphenol A-bis(diphenyl phosphate), 4 parts of d...

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Abstract

The invention provides an electronic equipment casing material and a preparation method thereof. The electronic equipment casing material is prepared from raw material components in parts by weight as follows: 30-70 parts of polyphenyl ether, 40-70 parts of high impact polystyrene, 10-15 parts of a flame retardant, 3-5 parts of an antioxidant, 1-3 parts of a lubricant and 1-2 parts of carbon block powder, wherein the flame retardant is selected from one or more of triphenyl phosphate, bisphenol-A bis(diphenyl phosphate), decabromodiphenyl ethane, antimony trioxide and tri(tribromophenyl) cyanurate. The raw material components are stirred and uniformly mixed, the mixture is placed in an extruder to extrusion, and an extruded product is cooled, diced and dried to prepare the casing material. During preparation of the casing material, the processing temperature is low, forming is easy, and the prepared casing material is light in mass, low in shrinkage and good in temperature resistance and flame retardance, and has a wide application range.

Description

technical field [0001] The invention relates to a casing material, in particular to a casing material of an electronic device and a preparation method thereof. Background technique [0002] The housing materials of electronic equipment are usually acrylonitrile-butadiene-styrene plastic (ABS), ABS engineering plastics (PC+ABS), high-impact polystyrene (HIPS), etc., the size of ABS, PC+ABS and other materials Excellent stability, impact resistance and processing fluidity, but the density is 1.15g / cm 3 Above, the quality is heavy, and the cost is high. HIPS is modified by adding styrene-butadiene or butadiene rubber to polystyrene (PS). Its cost is low and it is easy to form and process. However, the material has poor flame retardancy and high shrinkage. Electronic devices prepared using it The increased deformation of the shell during the reliability test and environmental test not only affects the appearance of the electronic device, but may even cause the shell to crack, ...

Claims

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Application Information

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IPC IPC(8): C08L51/04C08L71/12C08K13/02C08K5/03C08K3/22C08K5/3492C08K5/134C08K5/098C08K3/04C08K5/523B29C47/92B29C48/92
Inventor 孙言丽何洋
Owner HISENSE VISUAL TECH CO LTD
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