Ultrathin silver flat ribbon and preparation method thereof

A flat wire and ultra-thin technology, which is applied in the manufacture of semiconductor/solid-state devices, circuits, electric solid-state devices, etc., can solve the problems of ineffective use, uneven lead wires, rise, etc., and achieve easy promotion and use, and raw material ratio Reasonable and simple process

Inactive Publication Date: 2015-09-09
ANHUI JIEAO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] With the development of the market and technology, the function of the chip is continuously enhanced, the number of leads is increasing, and the volume is getting smaller and smaller, which leads to the continuous increase of the area ratio of the pad in the entire chip. Therefore, research on ultra-fine pitch bonding Technology is a key technology that mu

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Take the silver of 99.99g and the auxiliary material of 0.01g, (the auxiliary material carries out according to the composition of 1 part of iron, 3 parts of copper, 1 part of manganese, 2 parts of magnesium, 1 part of chromium, 3 parts of titanium, 2 parts of beryllium, 1 part of aluminum configuration), and then choose a vacuum furnace, put the silver in the raw material into the vacuum furnace, adjust the temperature in the furnace to 700°C, and carry out high-temperature smelting. After smelting, the auxiliary materials in the raw materials are added into the furnace in turn, and the speed is controlled to 2500r / min for high-speed stirring. After stirring evenly, after standing for 45 minutes, cast a silver rod with a diameter of 8mm through the casting mold, and then cool it naturally , and then drawn into a thick 3mm silver wire with a mold, anneal the 3mm thick silver wire at a high temperature of 500°C for 65 minutes, and then perform cold extrusion for 8-10 time...

Embodiment 2

[0021] Take the silver of 999.9g and the auxiliary material of 0.1g, (the auxiliary material is carried out according to the composition of 2 parts of iron, 4 parts of copper, 2 parts of manganese, 2.5 parts of magnesium, 2.5 parts of chromium, 3.5 parts of titanium, 3.5 parts of beryllium, 2.5 parts of aluminum configuration), then choose a vacuum furnace, put the silver in the raw material into the vacuum furnace, adjust the temperature in the furnace to 950°C, and carry out high-temperature smelting. After smelting, the auxiliary materials in the raw materials are added into the furnace in turn, and the speed is controlled to 2750r / min for high-speed stirring. After stirring evenly, after standing for 45 minutes, cast a silver rod with a diameter of 8mm through the casting mold, and then cool it naturally , and then drawn into a thick 3mm silver wire with a mold, anneal the 3mm thick silver wire at a high temperature of 750°C for 65 minutes, and then perform cold extrusion f...

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Abstract

The invention discloses an ultrathin silver flat ribbon, and relates to the technical field of production of bonding leads. The ultrathin silver flat ribbon is mainly manufactured from silver and an accessory, wherein the ratio of the silver to the accessory is 99.99: 0.01; and the accessory comprises the following raw materials in parts by weight: 1-3 parts of iron, 3-5 parts of copper, 1-3 parts of manganese, 2-3 parts of magnesium, 1-4 parts of chrome, 3-4 parts of titanium, 2-5 parts of beryllium, and 1-4 parts of aluminum. The ultrathin silver flat ribbon has the following beneficial effects: the process flow is simple; the raw material batching is reasonable; and as the silver and other mixed accessories are reasonably matched, and scientific and ordered steps are used for processing, prepared bonding wires are excellent in product quality and finer in fineness, are suitable for the present demands of the electronic industry, are applicable to various precise electronic devices, are excellent in use effect, and are convenient for promotion and application.

Description

technical field [0001] The invention relates to the technical field of bonding wire production, in particular to an ultra-fine silver flat ribbon and a preparation method thereof. Background technique [0002] Bonding wires are widely used in LEDs and semiconductor integrated circuits, such as consumer ICs: computers, mobile phones, televisions and other chips. Industrial IC: large-scale servers, motors, smart instruments, storage, medical equipment and other chips, and electronic packaging such as solar photovoltaics and diode transistors. [0003] With the development of the market and technology, the function of the chip is continuously enhanced, the number of leads is increasing, and the volume is getting smaller and smaller, which leads to the continuous increase of the area ratio of the pad in the entire chip. Therefore, research on ultra-fine pitch bonding Technology is a key technology that must be solved to solve the miniaturization of chips, but the performance of...

Claims

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Application Information

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IPC IPC(8): C22C5/06C22C5/08C22F1/14H01L23/49H01L21/60
CPCH01L2224/45014H01L2224/45139H01L24/43H01L2924/00011H01L2224/43H01L2224/45H01L2924/01026H01L2924/01029H01L2924/01025H01L2924/01012H01L2924/01024H01L2924/01022H01L2924/01004H01L2924/01013H01L2924/01204H01L2924/00012H01L2924/01005H01L2924/206
Inventor 范国伟范长云
Owner ANHUI JIEAO ELECTRONICS CO LTD
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