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Curable epoxy resin composition

A technology for curing epoxy resin and epoxy resin, used in anti-corrosion coatings, coatings, etc., can solve the problems of high viscosity and surface tension, low solid content, difficult to diffuse substrates, etc., to achieve good corrosion resistance and adhesion performance, Fast curing speed and good permeability

Inactive Publication Date: 2015-09-16
黎司华
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, commonly used epoxy resins have low solid content and contain a large amount of organic solvents, which are easy to cause organic solvents to volatilize during use, and these organic solvents include substances harmful to the environment and humans such as toluene
At the same time, due to the high viscosity and surface tension of the epoxy resin system, it is difficult to diffuse into the substrate, and it is difficult to have a large bonding force with the substrate.

Method used

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  • Curable epoxy resin composition

Examples

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Effect test

Embodiment 1

[0018] The curable epoxy resin composition of the present invention comprises the following components in parts by weight: 20 parts of epoxy resin, 25 parts of 3-isocyanate, 4 parts of polyamide curing agent, 8 parts of curing accelerator, 3 parts of epoxy phosphate, 5 parts of benzimidazole, 3 parts of titanium dioxide, 15 parts of calcium carbonate, 7 parts of silane coupling agent, 1 part of sodium dodecylbenzenesulfonate, 9 parts of polyacrylamide, deionized water 35 servings.

Embodiment 2

[0020] The curable epoxy resin composition of the present invention comprises the following components in parts by weight: 30 parts of epoxy resin, 15 parts of 3-propylene isocyanate, 12 parts of aliphatic amine curing agent, 2 parts of curing accelerator, cyclic 9 parts of oxygen phosphate, 1 part of benzimidazole, 10 parts of titanium dioxide, 5 parts of bentonite, 2 parts of aluminate coupling agent, 6 parts of sodium cetylbenzenesulfonate, 2 parts of polyvinyl alcohol, deionized water 25 servings.

Embodiment 3

[0022] The curable epoxy resin composition of the present invention comprises the following components in parts by weight: 25 parts of epoxy resin, 20 parts of 3-isocyanate, 8 parts of phenalkamine curing agent, 5 parts of curing accelerator, cyclic 6 parts of oxyphosphate, 3 parts of benzimidazole, 7 parts of titanium dioxide, 10 parts of mica powder, 4 parts of titanate coupling agent, 3 parts of quaternary ammonium compound, 6 parts of polyvinylpyrrolidone, and 30 parts of deionized water.

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Abstract

The invention discloses a curable epoxy resin composition. The curable epoxy resin composition is characterized by comprising the following components in parts by weight: 20 to 30 parts of epoxy resin, 15 to 25 parts of 3-allyl isocyanate, 4 to 12 parts of a curing agent, 2 to 8 parts of a curing accelerator, 3 to 9 parts of epoxy phosphate, 1 to 5 parts of benzimidazole, 3 to 10 parts of titanium dioxide, 5 to 15 parts of an inorganic filler, 2 to 7 parts of a coupling agent, 1 to 6 parts of a dispersing agent, 2 to 9 parts of a thickening agent and 25 to 35 parts of deionized water. According to the curable epoxy resin composition provided by the invention, water serves as a dispersing medium and the content of an inorganic / organic solvent or a volatile organic compound is low, so environmental pollution is avoided. Coating has the advantages of high curing speed, high permeability, corrosion resistance and high adhesion property, and is applicable to the industries such as printing, electron, coating and printing ink.

Description

technical field [0001] The present invention relates to a curable epoxy resin composition. Background technique [0002] Epoxy resin is an important class of thermosetting resin, and is the most widely used matrix resin in polymer composite materials. The cured epoxy resin has excellent bonding performance, wear resistance, mechanical performance, electrical insulation performance and chemical stability. , high and low temperature resistance, low shrinkage, easy processing and low cost, etc., are widely used in adhesives, light industry, coatings, electrical and electronic insulation materials and other fields. [0003] However, commonly used epoxy resins have low solid content and contain a large amount of organic solvents, which are likely to cause volatilization of organic solvents during use, and these organic solvents include toluene and other substances that are harmful to the environment and humans. At the same time, due to the high viscosity and surface tension of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D4/00C09D4/06C09D5/08C09D7/12C09D7/00
Inventor 黎司华
Owner 黎司华