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Multilayer film including first and second dielectric layers

A dielectric layer and multi-layer film technology, applied in the plating of superimposed layers, components of fixed capacitors, coatings, etc., to achieve the effects of low dielectric loss, high capacitance density value, and excellent insulating properties

Inactive Publication Date: 2015-09-23
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Additional challenges posed by discrete passive components include cost, handling, assembly time and yield

Method used

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  • Multilayer film including first and second dielectric layers
  • Multilayer film including first and second dielectric layers
  • Multilayer film including first and second dielectric layers

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0163] Copper foil (35 microns thick, 6.5 inches (16.5 cm) wide) is commercially available from Carl Schlenck AG (Barnsdorf, Germany) under the trade designation "ETP CDM 110". The surface roughness of the copper foil was measured using a Dektak 6M profilometer purchased from Veeco Instruments, Inc., (Plainview, NY). Take the average of three scans. The arithmetic mean of the absolute value of the surface measurement is 11 nanometers (nm), the root mean square is 14, the maximum valley depth is 46nm, the maximum peak height is 64nm, and the maximum profile height is 97nm.

[0164] Fix multiple copper foil samples on the figure 2 On the polymer transport film of the processing cartridge 106 of the apparatus 100 shown generally in FIG. The exposed surface of the copper foil was first plasma treated with argon gas at a flow rate of 500 standard cubic centimeters per minute (sccm) and a pressure of 300 mtorr (40 Pa). A plasma power of 600 W was used at a frequency of 400 kHz w...

example 2

[0172] For some of the samples prepared in Example 1, after the formation of the first and second dielectric layers, a layer of chromium bonding layer with a thickness of about 5 nm and a layer of copper with a thickness of about 15 nm were subsequently sputtered by DC sputtering seed layer. The structure was electroplated with copper to a thickness of approximately 12 microns.

[0173] Example

[0174] Copper foil samples (35 microns thick, 6.5 inches (16.5 cm) wide) available from Carl Schlenck AG under the trade designation "ETP CDM 110" were plasma treated and coated with a first dielectric as described in Example 1. layer. Thicknesses of 900 nm and 600 nm were targeted for the first dielectric layer to provide a dielectric layer comparable in thickness to the 800 nm dielectric layer thickness of Example 1 . To achieve a thickness of 600 nm, a drum speed of about 11.15 feet per minute (3.4 meters per minute) and a UV light exposure time of about 1.8 seconds was used. ...

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Abstract

A multilayer dielectric film including a first dielectric layer made from a material having a first breakdown field strength and a second dielectric layer disposed on the first dielectric layer made from a material having a different breakdown filed strength. A multilayer film including first and second electrically conductive layers separated by at least first and second dielectric layers is also disclosed. The first dielectric layer is disposed on the first electrically conductive layer, and the second dielectric layer is disposed on the first dielectric layer. The first electrically conductive layer can have at least one of an average surface roughness of at least ten nanometers, a thickness of at least ten micrometers, or an average visible light transmission of up to ten percent. The first dielectric layer may be a polymer and typically has a lower dielectric constant than the second dielectric layer, which may be ceramic.

Description

[0001] Cross references to related patent applications [0002] This patent application claims priority to US Provisional Application 61 / 728,986, filed November 21, 2012, and US Provisional Application 61 / 779,906, filed March 13, 2013. The disclosures of these provisional patent applications are incorporated herein by reference. Background technique [0003] In microelectronics, typically about 80% of electronic components fall into the category of passive components, which cannot add gain to circuit performance or perform switching functions. Surface-mount discrete components can occupy over 40% of the surface area of ​​a PCB / wiring board; such a large footprint presents challenges. Additional challenges presented by discrete passive components include cost, handling, assembly time and yield. [0004] Embedded passive components can provide an alternative to discrete passive components. By removing discrete passive components from the surface of the printed / wiring board a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/33H01G4/20H01L49/02H05K1/16H10N97/00
CPCH01L28/56H05K3/022H05K1/162H01G4/20H01G4/206H05K2203/1545H01G4/33H05K3/4655H05K1/0393C25D5/605C23C14/083C23C14/34C23C16/22C23C28/32C23C28/3455H01G4/10
Inventor D·格霍施C·S·莱昂斯R·E·戈里尔S·P·马基
Owner 3M INNOVATIVE PROPERTIES CO