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A technology of acrylic resin and conductive adhesive, applied in the field of conductive adhesive, can solve problems such as low electrical conductivity, hidden dangers in industrial application, easy to fall off, etc., and achieve high electrical conductivity, high thermal conductivity, and easy operation
Inactive Publication Date: 2015-10-07
苏州洋杰电子有限公司
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Abstract
Description
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Problems solved by technology
At present, the commercially available conductive adhesive has problems such as low conductivity and easy to fall off, which brings hidden dangers to industrial applications.
Method used
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Embodiment 1
[0019] A conductive adhesive containing modified acrylic resin, comprising the following components in parts by weight: 35 parts of modified acrylic resin, 10 parts of polybutadiene, 3 parts of m-hydroxybiphenyl, 80 parts of silver powder, 8 parts of toluene, 3 parts of polyisocyanate, 3 parts of 2-ethyl 4-methylimidazole, 1 part of triethylene glycol-bis[3-(3-tert-butyl-5-methyl-4-hydroxyphenyl) propionate];
[0020] The preparation method of the modified acrylic resin is as follows: in parts by weight, 10 parts of methacrylate, 4 parts of acrylate, 4 parts of hydroxymalonic acid, and 3 parts of zincoxide are dissolved in 0.1mol / L NaOH solution , heated to 50°C, reacted for 12 hours, washed with water and dried to obtain the modified acrylic resin.
Embodiment 2
[0022] A conductive adhesive containing modified acrylic resin, comprising the following components in parts by weight: 40 parts of modified acrylic resin, 12 parts of polybutadiene, 4 parts of m-hydroxybiphenyl, 95 parts of silver powder, 10 parts of tetrahydrofuran, 4 parts of polyisocyanate, 4 parts of 2-ethyl 4-methylimidazole, 2 parts of triethylene glycol-bis[3-(3-tert-butyl-5-methyl-4-hydroxyphenyl) propionate];
[0023] The preparation method of the modified acrylic resin is as follows: in parts by weight, 10 parts of methacrylate, 4 parts of acrylate, 4 parts of hydroxymalonic acid, and 3 parts of zincoxide are dissolved in 0.1mol / L NaOH solution , heated to 60°C, reacted for 12 hours, washed with water and dried to obtain the modified acrylic resin.
Embodiment 3
[0025] A conductive adhesive containing modified acrylic resin, comprising the following components in parts by weight: 42 parts of modified acrylic resin, 12 parts of polybutadiene, 4 parts of m-hydroxybiphenyl, 98 parts of silver powder, 11 parts of toluene, 5 parts of polyisocyanate, 4 parts of 2-ethyl 4-methylimidazole, 2 parts of triethylene glycol-bis[3-(3-tert-butyl-5-methyl-4-hydroxyphenyl) propionate];
[0026] The preparation method of the modified acrylic resin is as follows: in parts by weight, 15 parts of methacrylate, 5 parts of acrylate, 5 parts of hydroxymalonic acid and 4 parts of zinc oxide are dissolved in 0.2mol / L NaOH solution , heated to 70°C, reacted for 10 hours, washed with water and dried to obtain the modified acrylic resin.
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Abstract
The invention provides a conductive adhesive containing modified acrylic resin. The conductive adhesive containing modified acrylic resin comprises the following components in parts by weight: 35-50 parts of modified acrylic resin, 10-15 parts of polybutadiene, 3-5 parts of phenylphenol, 80-120 parts of aluminum powder, 8-13 parts of organic solvent, 3-6 parts of curing agent, 3-4 parts of curing accelerator and 1-3 parts of antioxidant. A preparation method of the modified acrylic resin comprises the steps of dissolving 10-20 parts of metacrylic acid ester, 4-6 parts of acrylic ester, 4-6 parts of hydroxymalonic acid and 3-5 parts of zincoxide by weight into water solution of alkali metalhydroxide, heating for reaction, washing with water after reaction and performing drying to obtain the modified acrylic resin. The conductive adhesive prepared by the invention has higher conductivity and heat conducting performance, can be cured at normal temperature, and is suitable for bonding between various materials, electromagnetic shielding, integrated circuit part installation and conductive bonding between metals.
Description
technical field [0001] The invention relates to the field of conductive adhesives, in particular to a conductive adhesive containing modified acrylic resin. Background technique [0002] Conductive adhesive is an adhesive with certain conductive properties after curing or drying. It usually uses matrix resin and conductive fillers, namely conductive particles, as the main components. The conductive particles are combined through the bonding effect of the matrix resin to form a conductive adhesive. Pathway to realize the conductive connection of the adhered material. Since the matrix resin of the conductive adhesive is an adhesive, a suitable curing temperature can be selected for bonding. At the same time, due to the miniaturization and miniaturization of electronic components and the rapid development of high density and high integration of printed circuit boards, The conductive adhesive can be made into a paste to achieve high line resolution. Moreover, the conductive ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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Application Information
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