Electrocoppering thin film circuit and additive manufacturing method thereof

Abstract

The invention relates to an electrocoppering thin film circuit and an additive manufacturing method thereof. The manufacturing method comprises the steps of: 1) performing high frequency corona and surface coating processing on an insulation base material to prepare a priming layer; 2) printing catalyst or reducing agent printing ink on the priming layer; 3) successively performing chemical non-electric electroplating and multistage electric electroplating on the printed priming layer to thicken a copper plating layer; 4) printing an anisotropic conductive adhesive at the position of the copper plating layer needing to bonded with a chip to obtain an anisotropic conductive adhesive trace; 5) coating an antioxidation coating; and 6) storing a finished products in a warehousing. The electrocoppering thin film circuit of the invention comprises the antioxidation coating, the copper plating layer, the catalyst or reducing agent printing ink, the insulation base material, the anisotropic conductive adhesive trace and the priming layer; the antioxidation coating, the anisotropic conductive adhesive trace, the copper plating layer, the catalyst or reducing agent printing ink, the priming layer and the insulation base material are successively arranged from top to bottom. Compared with the prior art, the electrocoppering thin film circuit has the advantages of good conductivity, high folding endurance, small pollution, low cost, etc.

Description

technical field [0001] The invention relates to a metal film circuit, in particular to an electroplated copper film circuit and an additive manufacturing method thereof. Background technique [0002] With the continuous development of the Internet of Things, the market demand for radio frequency identification (Radio Frequency Identification, RFID) electronic tags has greatly increased, and there is a broad prospect. However, the manufacturing method of the antenna, an important part of the RFID electronic tag, has always been flawed, which has seriously restricted the further development of the RFID tag market. The current RFID electronic tag antenna is generally made by etching aluminum foil, and aluminum has poor conductivity and easy oxidation, the antenna is easy to break, and the Q value is not high (the higher the Q value, the smaller the loss of electrical properties and the higher the efficiency) ; The etching process will corrode a large amount of metal raw materi...

AI Technical Summary

Problems solved by technology

However, the manufacturing method of the antenna, an important part of the RFID electronic tag, has always been flawed, which has seriously restricted the further development of the RFID tag market.

The current RFID electronic tag antenna is generally made by etching aluminum foil, and aluminum has poor conductivity and easy oxidation, the antenna is easy to break, and the Q value is not high (the higher the Q value, the smaller the loss of electrical properties and the higher the efficiency) ; The etching process will corrode a large amount of metal raw materials during the preparation process, and more than 80% of the aluminum metal will be corroded, leaving less than 20% to make products, resulting in great waste; in addition, the etching antenna is used in the production process A variety of acid-base chemicals are used, which will generate a lot of waste water

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